메뉴 건너뛰기




Volumn 53, Issue 9, 2006, Pages 2168-2177

Modeling of variation in submicrometer CMOS ULSI technologies

Author keywords

Integrated circuit modeling; Semiconductor device modeling; Semiconductor device variation; Semiconductor devices; Silicon on insulator (SOI) technology; Tolerance analysis

Indexed keywords

INTEGRATED CIRCUIT MODELING; LINEWIDTH VARIATION; SEMICONDUCTOR DEVICE MODELING; SEMICONDUCTOR DEVICE VARIATION; TOLERANCE ANALYSIS;

EID: 33846269390     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2006.880165     Document Type: Article
Times cited : (69)

References (42)
  • 7
    • 33745148992 scopus 로고    scopus 로고
    • High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
    • E. Leobandung et al., "High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell," in VLSI Symp. Tech. Dig., 2005, pp. 126-127.
    • (2005) VLSI Symp. Tech. Dig , pp. 126-127
    • Leobandung, E.1
  • 9
    • 23944519011 scopus 로고    scopus 로고
    • Device and technology evolution for Si-based RF integrated circuits
    • Jul
    • H. Bennett et al., "Device and technology evolution for Si-based RF integrated circuits," IEEE Trans. Electron Devices, vol. 52, no. 7, pp. 1235-1258, Jul. 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , Issue.7 , pp. 1235-1258
    • Bennett, H.1
  • 10
    • 23944493427 scopus 로고    scopus 로고
    • Modeling of statistical low-frequency noise of deep-submicrometer MOSFETs
    • Jul
    • G. Wirth, J. Koh, R. da Silva, R. Thewes, and R. Brederlow, "Modeling of statistical low-frequency noise of deep-submicrometer MOSFETs," IEEE Trans. Electron Devices, vol. 52, no. 7, pp. 1576-1588, Jul. 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , Issue.7 , pp. 1576-1588
    • Wirth, G.1    Koh, J.2    da Silva, R.3    Thewes, R.4    Brederlow, R.5
  • 11
    • 4544304166 scopus 로고    scopus 로고
    • A 10+ GHz low jitter wide band PLL in 90 nm PD SOI CMOS technology
    • D. Boerstler et al., "A 10+ GHz low jitter wide band PLL in 90 nm PD SOI CMOS technology," in Proc. Symp. VLSI Circuits, 2004, pp. 228-231.
    • (2004) Proc. Symp. VLSI Circuits , pp. 228-231
    • Boerstler, D.1
  • 12
    • 31344457004 scopus 로고    scopus 로고
    • Overview of the architecture, circuit design, and physical implementation of a first-generation cell processor
    • Jan
    • D. Pham et al., "Overview of the architecture, circuit design, and physical implementation of a first-generation cell processor," IEEE J. Solid-State Circuits, vol. 41, no. 1, pp. 179-196, Jan. 2006.
    • (2006) IEEE J. Solid-State Circuits , vol.41 , Issue.1 , pp. 179-196
    • Pham, D.1
  • 13
    • 33645728267 scopus 로고    scopus 로고
    • Statistical BSIM model for MOSFET 1/f noise
    • Oct
    • M. Erturk, T. Xia, R. Anna, K. Newton, and E. Adler, "Statistical BSIM model for MOSFET 1/f noise," Electron. Lett., vol. 41, no. 22, pp. 1208-1210, Oct. 2005.
    • (2005) Electron. Lett , vol.41 , Issue.22 , pp. 1208-1210
    • Erturk, M.1    Xia, T.2    Anna, R.3    Newton, K.4    Adler, E.5
  • 14
    • 4444279488 scopus 로고    scopus 로고
    • STAC: Statistical timing analysis with correlation
    • J. Le, X. Li, and L. Pileggi, "STAC: Statistical timing analysis with correlation," in Proc. Des. Autom. Conf., 2004, pp. 343-348.
    • (2004) Proc. Des. Autom. Conf , pp. 343-348
    • Le, J.1    Li, X.2    Pileggi, L.3
  • 15
    • 4444353564 scopus 로고    scopus 로고
    • Toward a systematic-variation aware timing methodology
    • P. Gupta and F. Heng, "'Toward a systematic-variation aware timing methodology," in Proc. Des. Autom. Conf., 2004, pp. 321-326.
    • (2004) Proc. Des. Autom. Conf , pp. 321-326
    • Gupta, P.1    Heng, F.2
  • 17
    • 0037346346 scopus 로고    scopus 로고
    • Understanding MOSFET mismatch for analog design
    • Mar
    • P. Drennan and C. McAndrew, "Understanding MOSFET mismatch for analog design," IEEE J. Solid-Stale Circuits, vol. 38, no. 3, pp. 450-456, Mar. 2003.
    • (2003) IEEE J. Solid-Stale Circuits , vol.38 , Issue.3 , pp. 450-456
    • Drennan, P.1    McAndrew, C.2
  • 20
    • 33845186855 scopus 로고    scopus 로고
    • On Idlow with emphasis on speculative SPICE modeling
    • Q. Chen et al., "On Idlow with emphasis on speculative SPICE modeling," in Proc. NSTI Nanotech, Workshop Compact Modeling, 2006 pp. 831-834.
    • (2006) Proc. NSTI Nanotech, Workshop Compact Modeling , pp. 831-834
    • Chen, Q.1
  • 21
    • 33144475038 scopus 로고    scopus 로고
    • Ring oscillators for CMOS process tuning and variability control
    • Feb
    • M. Bhushan, A. Gattiker, M. Kelchen, and K. Koushik, "Ring oscillators for CMOS process tuning and variability control," IEEE Trans. Semicond. Manuf., vol. 19, no. 1, pp. 10-18, Feb. 2006.
    • (2006) IEEE Trans. Semicond. Manuf , vol.19 , Issue.1 , pp. 10-18
    • Bhushan, M.1    Gattiker, A.2    Kelchen, M.3    Koushik, K.4
  • 23
    • 77951212383 scopus 로고    scopus 로고
    • Junction scaling for next generation microprocessor technologies
    • Apr
    • T. Feudel et al., "Junction scaling for next generation microprocessor technologies," in Proc. SEMI Technology Sessions, SEMICON Europa, Apr. 2005.
    • (2005) Proc. SEMI Technology Sessions, SEMICON Europa
    • Feudel, T.1
  • 24
    • 33947137978 scopus 로고    scopus 로고
    • Spike RTP for ultra-shallow junction formation
    • Online, Available
    • P. Timans, "Spike RTP for ultra-shallow junction formation," in Proc. Amer. Vac. Soc. West Coast Technol. Group, 2002, p. 13. [Online]. Available: http://www.avsusergroups.org/index.cfm?menu=gsviug&page= gsviug_month&year=2002&Month=7
    • (2002) Proc. Amer. Vac. Soc. West Coast Technol. Group , pp. 13
    • Timans, P.1
  • 25
    • 33947108696 scopus 로고    scopus 로고
    • RTA-driven intra-die variations in stage delay, and parametric sensitivities for 65 nm technology
    • to be published
    • I. Ahsan et al., "RTA-driven intra-die variations in stage delay, and parametric sensitivities for 65 nm technology," in VLSI Symp. Tech. Dig., 2006. to be published.
    • (2006) VLSI Symp. Tech. Dig
    • Ahsan, I.1
  • 26
    • 0042411906 scopus 로고    scopus 로고
    • Lateral ion implant straggle and mask proximity effect
    • Sep
    • T. Hook et al., "Lateral ion implant straggle and mask proximity effect," IEEE Trans. Electron Devices, vol. 50, no. 9, pp. 1946-1951, Sep. 2003.
    • (2003) IEEE Trans. Electron Devices , vol.50 , Issue.9 , pp. 1946-1951
    • Hook, T.1
  • 27
    • 33644627903 scopus 로고    scopus 로고
    • Effect of contact liner stress in high-performance FDSOI devices with ultra-thin silicon channels and 30 nm gate lengths
    • D. V. Singh et al., "Effect of contact liner stress in high-performance FDSOI devices with ultra-thin silicon channels and 30 nm gate lengths," in Proc. Int. SOI Conf., 2005, pp. 178-179.
    • (2005) Proc. Int. SOI Conf , pp. 178-179
    • Singh, D.V.1
  • 28
    • 33745709138 scopus 로고    scopus 로고
    • High-performance CMOSFET technology for 45 nm generation and scalability of stress-induced mobility enhancement technique
    • A. Oishi et al., "High-performance CMOSFET technology for 45 nm generation and scalability of stress-induced mobility enhancement technique," in IEDM Tech. Dig., 2005, pp. 239-242.
    • (2005) IEDM Tech. Dig , pp. 239-242
    • Oishi, A.1
  • 29
    • 0036932273 scopus 로고    scopus 로고
    • Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance
    • R. Blanchi, G. Bouche, and O. Roux-dit-Buisson, "Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance," in IEDM Tech. Dig., 2002, pp. 117-120.
    • (2002) IEDM Tech. Dig , pp. 117-120
    • Blanchi, R.1    Bouche, G.2    Roux-dit-Buisson, O.3
  • 30
    • 0242696135 scopus 로고    scopus 로고
    • A scalable for STI mechanical stress effect on layout dependence of MOS characteristics
    • K.-W. Su et al., "A scalable for STI mechanical stress effect on layout dependence of MOS characteristics," in Proc. Custom Integr. Circuits Conf., 2003, pp. 245-248.
    • (2003) Proc. Custom Integr. Circuits Conf , pp. 245-248
    • Su, K.-W.1
  • 31
    • 33845195191 scopus 로고    scopus 로고
    • ERIE, A new parasitic model extraction tool
    • P. Habitz et al., "ERIE, A new parasitic model extraction tool," IBM Micronews, vol. 7, no. 1, pp. 32-36, 2001.
    • (2001) IBM Micronews , vol.7 , Issue.1 , pp. 32-36
    • Habitz, P.1
  • 32
    • 33947180754 scopus 로고    scopus 로고
    • Online, Available
    • Calibre Interactive User's Manual, 2006. [Online]. Available: http://www.mentor.com/dsm/customer/documentation/2006.2_22/calbr_inter_user.pdf
    • (2006) Calibre Interactive User's Manual
  • 33
    • 33947106774 scopus 로고    scopus 로고
    • UCB BSIMPD version 2.2.3 Compact Model, Online, Available
    • UCB BSIMPD version 2.2.3 Compact Model. [Online]. Available: http://www-device.eecs.berkeley.edu/~bsimsoi/arch_ftp.html
  • 34
    • 0023980926 scopus 로고
    • Unified presentation of I// noise in electron devices: Fundamental 1/f noise sources
    • Mar
    • A. van der Ziel, "Unified presentation of I// noise in electron devices: Fundamental 1/f noise sources," Proc. Inst. Electr. Eng., vol. 76, no. 3, pp. 233-258, Mar. 1988.
    • (1988) Proc. Inst. Electr. Eng , vol.76 , Issue.3 , pp. 233-258
    • van der Ziel, A.1
  • 35
    • 28244475910 scopus 로고    scopus 로고
    • Integration of a mechanically reliable 65 nm node technology for low-fc and ULK interconnects with various substrate and package types
    • Jun
    • C. Goldberg et al., "Integration of a mechanically reliable 65 nm node technology for low-fc and ULK interconnects with various substrate and package types," in Proc. Int. Interconnect Technol. Conf., Jun. 2005, pp. 3-5.
    • (2005) Proc. Int. Interconnect Technol. Conf , pp. 3-5
    • Goldberg, C.1
  • 36
    • 28244489870 scopus 로고    scopus 로고
    • BEOL process integration with Cu/SiCOH (k = 2.8) low-A; interconnects at 65 nm groundrules
    • Jun
    • M. Fukasawa et al., "BEOL process integration with Cu/SiCOH (k = 2.8) low-A; interconnects at 65 nm groundrules," in Proc. Int. Interconnect Technol. Conf., Jun. 2005, pp. 9-11.
    • (2005) Proc. Int. Interconnect Technol. Conf , pp. 9-11
    • Fukasawa, M.1
  • 37
    • 28244498367 scopus 로고    scopus 로고
    • Impact of interconnect technology scaling on SOC design methodology
    • Jun
    • N. Nsgaraj et al., "Impact of interconnect technology scaling on SOC design methodology," in Proc. Int. Interconnect Technol. Conf., Jun. 2005, pp. 71-73.
    • (2005) Proc. Int. Interconnect Technol. Conf , pp. 71-73
    • Nsgaraj, N.1
  • 38
    • 28244438406 scopus 로고    scopus 로고
    • Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact
    • Jun
    • J. Farcy et al., "Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact," in Proc. Int. Interconnect Technol. Conf., Jun. 2005, pp. 74-76.
    • (2005) Proc. Int. Interconnect Technol. Conf , pp. 74-76
    • Farcy, J.1
  • 39
    • 33947108193 scopus 로고    scopus 로고
    • IBM interconnect modeling
    • N. Lu, M. Tong, and E. Conrad, "IBM interconnect modeling," IBM MicroNews, vol. 5, no. 4, pp. 22-25, 1999.
    • (1999) IBM MicroNews , vol.5 , Issue.4 , pp. 22-25
    • Lu, N.1    Tong, M.2    Conrad, E.3
  • 40
    • 33947110226 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors, Modeling and Simulation, Online, Available
    • International Technology Roadmap for Semiconductors - Modeling and Simulation, 2005. [Online]. Available: http://www.itrs.net/Common/2005ITRS/ Home205.htm
    • (2005)
  • 41
    • 0036923996 scopus 로고    scopus 로고
    • A high performance 90 nm SOI technology with 0.992 μ2 6T-SRAM cell
    • M. Khare et al., "A high performance 90 nm SOI technology with 0.992 μ2 6T-SRAM cell," in IEDM Tech. Dig., 2002, pp. 407-410.
    • (2002) IEDM Tech. Dig , pp. 407-410
    • Khare, M.1
  • 42
    • 23944446418 scopus 로고    scopus 로고
    • max, 90 nm SOI CMOS SoC technology with low-power mm-wave digital and RF circuit capability
    • Jul
    • max, 90 nm SOI CMOS SoC technology with low-power mm-wave digital and RF circuit capability," IEEE Trans. Electron Devices, vol. 52, no. 7, pp. 1370-1375, Jul. 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , Issue.7 , pp. 1370-1375
    • Plouchart, J.-O.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.