Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 74-76

  Farcy, A ^a   Cueto, O ^b   Blampey, B ^c   Arnal, V ^a   Gosset, L G ^d   Besling, W F A ^d   Chhun, S ^d   Lacrevaz, T ^a,c   Bermond, C ^c   Flechet B ^c   Rousiere O ^a   De Crecy F ^b   Angenieux G ^c   Torres, J ^a  

^a STMICROELECTRONICS   (France)

^b CEA GRENOBLE   (France)

^c UNIVERSITÉ DE SAVOIE   (France)

^d NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRACK PROPAGATION; ELECTROMAGNETIC FIELDS; LARGE SCALE SYSTEMS; METALLIZING;

CIRCUIT PERFORMANCE; PARASITIC PROPAGATION DELAY; SIGNAL PROPAGATION;

SIGNAL PROCESSING;

EID: 28244438406     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M.T. Bohr, IEDM technical digest, p. 241, 1995.
2. W.F.A. Besling, V. Arnal, J.F. Guillaumond, C. Guedj, M. Broekaart, L.L. Chapelon, A. Farcy, L. Arnaud, and J. Torres, IEDM technical digest, p. 325, 2004.
3. A. Farcy, O. Cueto, B. Blampey, T. Lacrevaz, B. Fléchet, F. de Crécy, and J. Torres, proceedings of SPI, p. 17, 2004.
4. A.K Stamper, C. Christiansen, E. Cooney, J. Gill, T. McDevitt, M. Moon, S. Moskowitz, B. Porth, R. Wenner, A. Winslow, R. Wistrom, and R. Zwonik, proceedings of AMC, p. 133, 2003.
5. L. G. Gosset, V. Arnal, C. Prindle, R. Hoofman, G. Verheijden, R. Daamen, L Broussous, F. Fusalba, M. Assous, R. Chatterjee, J. Torres, D. Gravesteijn, K.C. Yu, proceedings of IITC, p. 65, 2003.
6. L.G. Gosset, S. Chhun, A. Farcy, N. Casanova, V. Arnal, W.F.A. Besling, and J. Torres, proceedings of IITC, p. 15, 2004.