Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators

Journal of Microelectromechanical Systems

Volumn 15, Issue 6, 2006, Pages 1446-1456

  Candler, Rob N ^a,b   Hopcroft, Matthew A ^a   Kim, Bongsang ^a   Park, Woo Tae ^a   Melamud, Renata ^a   Agarwal, Manu ^a   Yama, Gary ^b   Partridge, Aaron ^b,c   Lutz, Markus ^b,c   Kenny, Thomas W ^a  

^a Stanford University   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

^c SiTime Corporation   (United States)

Author keywords

Encapsulation; Hermetic; Microelectromechanical systems (MEMS); Micromechanical resonator; Packaging; Pressure; Wafer level

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; HERMETIC SEALS; MICROELECTROMECHANICAL DEVICES; POLYSILICON; SEALING (CLOSING); SILICON WAFERS; THERMAL EFFECTS;

LIFE TESTING; MICROMECHANICAL RESONATOR; WAFER-LEVEL;

CAVITY RESONATORS;

EID: 33845545957     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.883586     Document Type: Article

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