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Volumn 1, Issue , 2005, Pages 920-923

Hydrogen diffusion and pressure control of encapsulated mems resonators

Author keywords

Hermetic packaging; Hydrogen diffusion; Quality factor; Resonator

Indexed keywords

HERMETIC PACKAGING; HYDROGEN DIFFUSION; QUALITY FACTOR; VACUUM PACKAGE;

EID: 27544502546     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1496568     Document Type: Conference Paper
Times cited : (38)

References (8)
  • 1
    • 26844529375 scopus 로고    scopus 로고
    • Wafer-level vacuum package with vertical feedthroughs
    • J. Chae, J. M. Gianchino, and K. Najafi, "Wafer-Level Vacuum Package with Vertical Feedthroughs," presented at MEMS 05, 2005.
    • (2005) MEMS 05
    • Chae, J.1    Gianchino, J.M.2    Najafi, K.3
  • 2
    • 0036544329 scopus 로고    scopus 로고
    • Accelerated hermiticity testing of a glass-silicon package formed by rapid thermal processing aluminum-to-silicon nitride bonding
    • M. Chiao and L. Lin, "Accelerated hermiticity testing of a glass-silicon package formed by rapid thermal processing aluminum-to-silicon nitride bonding," Sensors and Actuators A, vol. 97-98, pp. 405-405, 2002.
    • (2002) Sensors and Actuators A , vol.97-98 , pp. 405-405
    • Chiao, M.1    Lin, L.2
  • 6
    • 0001447155 scopus 로고
    • Miniaturization of tuning forks
    • W. E. Newell, "Miniaturization of Tuning Forks," Science, pp. 1320-1326, 1968.
    • (1968) Science , pp. 1320-1326
    • Newell, W.E.1
  • 7
    • 0034187781 scopus 로고    scopus 로고
    • Hydrogen diffusion through silicon/silicon dioxide interfaces
    • N. H. Nickel, "Hydrogen Diffusion Through Silicon/Silicon Dioxide Interfaces," J. Vac. Sci. Tehcnol. B, vol. 18, pp. 1770-1772, 2000
    • (2000) J. Vac. Sci. Tehcnol. B , vol.18 , pp. 1770-1772
    • Nickel, N.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.