Encapsulation of vacuum sensors in a wafer level package using a gold-silicon eutectic

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 928-931

  Mitchell, Jay ^a   Lahiji, G R ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Eutectic bonding; Gold silicon eutectic; Packaging; Solder bonding; Vacuum

Indexed keywords

EUTECTIC BONDING; GOLD SILICON EUTECTIC; SOLDER BONDING; WAFER BONDING;

BONDING; EUTECTICS; GOLD; SENSORS; SILICON; SOLDERING; VACUUM;

ELECTRONICS PACKAGING;

EID: 27544472319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1496570     Document Type: Conference Paper

References (9)

1. B.H. Stark and K. Najafi, "A low-temperature thin-film electroplated metal vacuum package," J. Microelectromech Syst, 13, 147-157 (2004).
2. C.H. Mastrangelo and R.S. Muller, "Vacuum-sealed silicon micromachined incandescent light source," Tech. Digest, Int. Electron Devices Meeting, 503-506 (1989).
3. B. Lee, S. Seok and K. Chun, "A study on wafer level vacuum packaging for MEMS devices," J Micromech Microengineering, 13, 663-669, (2003).
4. M. Ebert and J. Bagdahn, "Determination of residual stress in glass frit bonded MEMS by finite element analysis," Int. Conf on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 407-412 (2004).
5. Y. Cheng, W. Hsu, K. Najafi, C.T.-. Nguyen and L. Lin, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," J. Microelectromech Syst. 11, 556-565, (2002).
6. R.W. Chuang and C.C. Lee, "High-temperature noneutectic indium-tin joints fabricated by a fluxless process," Thin Solid Films, 414, 175-179 (2002).
7. Y. Mei, G.R. Lahiji and K. Najafi, "A Robust Gold-Silicon Eutectic Wafer Bonding Technology for Vacuum Packaging," in Technical Digest, Solid-State Sensor, Actuator and Microsystems Workshop, 772-774 (2002).
8. J.S. Mitchell, G.R. Lahiji and K. Najafi, "An Improved Performance Poly Si Pirani Vacuum Gauge Using Heat Distributing Structural Supports," in Proceedings of IEEE MEMS Conference, 291-294 (2005).
9. D.R. Sparks, N. Najafi and S. Massoud-Ansari, "Chip-Level Vacuum Packaging of Micromachines Using Nanogetters," IEEE Transactions on Advanced Packaging, 26, 277-282 (2003).