Zr/V/Fe thick film for vacuum packaging of MEMS

Journal of Micromechanics and Microengineering

Volumn 14, Issue 5, 2004, Pages 687-692

  Jin, Yufeng ^a,c   Wang, Zhenfeng ^a   Zhao, Lei ^b   Lim, Peck Cheng ^a   Wei, Jun ^a   Wong, Chee Khuen ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b Nanjing Delta King Hi Tech Co Ltd   (China)

^c PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION TEMPERATURES; GLASS WAFERS; METALLIC SUBSTRATES; VACUUM PACKAGING;

ANODES; CHEMICAL BONDS; COATING TECHNIQUES; ELECTRONICS PACKAGING; EVAPORATION; IRON; METALLIC FILMS; MICROELECTROMECHANICAL DEVICES; POLYSILICON; SINTERING; VACUUM APPLICATIONS; VANADIUM; ZIRCONIUM;

THICK FILMS;

EID: 2542473165     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/5/005     Document Type: Article

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