Sub-mm encapsulated accelerometers: A fully implantable sensor for cochlear implants

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 109-112

  Park, Woo Tae ^a   O'Connor, Kevin N ^a,c   Mallon Jr , Joseph R ^a,c   Maetani, Toshiki ^a,c   Candler, Rob N ^a   Ayanoor Vitikkate, Vipin ^a   Roberson, Joseph B ^a,b   Puria, Sunil ^a,c   Kenny, Thomas W ^a  

^a STANFORD UNIVERSITY   (United States)

^b California Ear Institute   (United States)

^c VETERANS AFFAIRS MEDICAL CENTER   (United States)

Author keywords

Accelerometer; Cochlear implant; Epi poly Encapsulation

Indexed keywords

COCHLEAR IMPLANT; EAR IMPLANTS; EPI-POLY ENCAPSULATION; TYMPANIC MEMBRANES;

ELECTRONICS PACKAGING; IMPLANTS (SURGICAL); POLYSILICON; SENSORS; THIN FILMS;

ACCELEROMETERS;

EID: 27544506092     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. S. Puria and R.C. Perkins (2003), "Flextensional microphones for implantable hearing devices" US patent 6,554,761
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3. H.P. Zenner, M.M. Maassen, P.K. Plinkert, R. Zimmermann, J.W.Baumann, G. Reischl, and H. Leysieffer, "First implantation of a totally implantable electronic hearing aid in patients with inner ear hearing loss", HNO, 1998. 46(10): pp 844-52.
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5. W.-T. Park, R.N. Candler, V. Ayanoor-Vitikkate, M. Lutz, A. Partridge, G. Yama, and T.W. Kenny, "Fully Encapsulated Sub-millimeter Accelerometers", Tech Digest, IEEE MEMS 2005, pp. 347-350, Miami, FL, USA, Jan. 30-Feb 3, 2005
6. W.-T. Park, R.N. Candler, S. Kronmueller, M. Lutz, A. Partridge, G. Yama, and T.W. Kenny, "Wafer-Scale Film Encapsulation of Micromachined Acceleromters", Transducers2003, pp 1903-1906, Boston, MA, USA, June 2003
7. R.N. Candler, W.-T. Park, M. Hopcroft, B. Kim, T.W. Kenny, "Hydrogen Diffusion and Pressure Control of Encapsulated MEMS Resonator", Tech Digest, Transducers 2005, to be published, Seoul, Korea, June 5-9, 2005
8. C. Li, F.E. Sauser, R. Azizkhan, C.H. Ahn, and I. Papautsky, "Polymer Flip-chip Bonding of Pressure Sensors on Flexible Kapton Film for Neonatal Catheters", Tech Digest, IEEE MEMS 2004, pp. 749-752, Maastricht, Netherlands, Jan. 25-29, 2004
9. S. Puria "Measurements of human middle ear forward and reverse acoustics: implications for otoacoustic emissions" J Acoust Soc Am, 2003. 113(5):pp 2773-89