Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS

IEEE Transactions on Microwave Theory and Techniques

Volumn 52, Issue 6, 2004, Pages 1626-1636

  Margomenos, Alexandros ^a,b   Katehi, Linda P B ^c  

^a UNIVERSITY OF MICHIGAN   (United States)

^b EMAG Technologies Inc   (United States)

^c PURDUE UNIVERSITY   (United States)

Author keywords

Hermeticity testing; On wafer packaging; RF microelectromechanical systems (MEMS); Silicon micromachining

Indexed keywords

ACCELEROMETERS; AUTOCLAVES; DIELECTRIC DEVICES; GYROSCOPES; HERMETIC DEVICES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; POLYSILICON; RADIO FREQUENCY AMPLIFIERS; SILICON WAFERS; SWITCHING SYSTEMS; THIN FILM CIRCUITS; WSI CIRCUITS;

FREQUENCY BAND; HERMETICITY TESTING; ON-WAFER PACKAGING; SILICON MICROMACHINING;

ELECTRONICS PACKAGING;

EID: 2942511587     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2004.828467     Document Type: Article

References (45)

1. G. M. Rebeiz, RF MEMS Theory, Design, and Technology. Hoboken, NJ: Wiley, 2003.
2. C. Goldsmith, T.-H. Lin, W.-R. Powers, and B. Norvell, "Micromechanical membrane switches for microwave applications," in IEEE MTT-S Int. Microwave Symp. Dig., Orlando, FL, May 1995, pp. 91-94.
3. Kryocera America Inc., "A DC to Ka-band low cost mountable RF-via package," Microwave J., pp. 216-222, Jan. 2001.
4. A. Margomenos, D. Peroulis, K. J. Herrick, and L. P. B. Katehi, "Silicon micromachined packages for RF MEMS switches," in Eur. Microwave Conf. Dig., London, U.K., Sept, 2001, pp. 35-38.
5. A. Jourdain, X. Rottenberg, G. Carchon, and H. A. C. Tilmans, "Optimization of O-level packaging for RF MEMS devices," in Int. Solid-State Sensors and Actuators, Transducers Conf., Boston, MA, June 2003, pp. 1915-1918.
6. C. Harendt, H. G. Graf, B. Höfflinger, and J. E. Penteker, "Silicon fusion bonding and its characterization," J. Micromech. Microeng., vol. 2, pp. 113-116, 1992.
7. G. Wallis and D. I. Pomerantz, "Field-assisted glass-metal sealing," J. Appl. Phys., vol. 40, pp. 3946-3949, 1969.
8. B. H. Stark and K. Najafi, "An integrated process for post-packaging release and vacuum sealing of electroplated nickel packages," in Int. Solid-State Sensors and Actuators, Transducers Conf., Boston, MA, June 2003, pp. 1911-1914.
9. P. P. L. Chang-Chien and K. D. Wise, "Wafer level packaging using localized mass deposition," in Int. Solid-State Sensors and Actuators, Transducers Conf., Munich, Germany, June 2001, pp. 182-185.
10. D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi, and K. Jaykar, "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," J. Micromech. Microeng., vol. 11, pp. 630-634, 2001.
11. M. Chiao and L. Lin, "Accelerated hermeticity testing of a glass-silicon package formed by rapid thermal processing aluminum-to-silicon nitride bonding," Sens. Actuators A, no. 97-98, pp. 405-409, 2002.
12. Y. T. Cheng, L. Lin, and K. Najafi, "A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding," J. Microelectromech. Syst., vol. 10, pp. 392-399, Sept. 2001.
13. R. F. Wolffenbutel, "Low temperature intermediate Au-Si wafer bonding; eutectic or silicide bond," Sens. Actuators A, vol. 62, pp. 680-686, 1997.
14. T. Itoh, H. Okada, H. Takagi, R. Maeda, and T. Suga, "Room temperature vacuum sealing using surface activated bonding method," in Int. Solid-State Sensors and Actuators, Transducers Conf., Boston, MA, June 2003, pp. 1828-1831.
15. M. Hansen and K. Anderko, Constitution of Binary Alloys McGraw-Hill, New York, 1958.
16. J. Kennedy, "Surface mount components reduce broadband equipment costs,"Appl. Microwave Wireless, vol. 13, no. 1, pp. 102-108, Jan. 2001.
17. K. J. Herrick, "W-band three-dimensional integrated circuits utilizing silicon micromachining," Ph.D. dissertation, Dept. Elect. Eng. Comput. Sci., Univ. Michigan at Ann Arbor, Ann Arbor, MI, 2000.
18. K. J. Herrick and L. P. B. Katehi, "RF W-band wafer-to-wafer transition," IEEE Trans. Microwave Theory Tech., vol. 49, pp. 600-608, Apr. 2001.
19. A. Margomenos, D. Peroulis, J. P. Becker, and L. P. B. Katehi, "Silicon micromachined interconnects for on-wafer packaging of MEMS devices," in Silicon Monolithic Integrated Circuits in RF Systems Dig., Ann Arbor, MI, Sept. 2001, pp. 33-36.
20. K J. Herrick, J. G. Yook, and L. P. B. Katehi, "Microtechnology in the development of three-dimensional circuits," IEEE Trans. Microwave Theory Tech., vol. 46, pp. 1832-1844, Nov. 1998.
21. A. Margomenos and L. P. B. Katehi, "DC to 40 GHz on-wafer package for RF MEMS switches," in IEEE Electronic Performance of Electronic Packaging Topical Meeting Dig., Oct. 2002, pp. 91-94.
22. S. P. Pacheco, L. P. B. Katehi, and C. T. C. Nguyen, "Design of low actuation voltage RF MEMS switch," in IEEE MTT-S Int. Microwave Symp. Dig., Boston, MA, June 2000, pp. 167-170.
23. D. Peroulis, S. P. Pacheco, K. Sarabandi, and L. P. B. Katehi, "Electromechanical considerations in developing low-voltage RF MEMS switches," IEEE Trans. Microwave Theory Tech., vol. 51, pp. 259-270, Jan. 2003.
24. A. Margomenos and L. P. B. Katehi, "High frequency parasitic effects for on-wafer packaging of RF MEMS switches," in IEEE MTT-S Int. Microwave Symp. Dig., Philadelphia, PA, June 2003, pp. 1875-1878.
25. K. L. Perkins, J. J. Licari, and R. L. Buckelew, "Investigation of moisture effects on selected microelectronic devices," in Proc. Int. Society of Hybrid Microelectronics Symp., 1978, pp. 145-148.
26. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook. New York: Int. Thompson Publishing, 1997.
27. Y. T. Cheng, W. T. Hsu, L. Lin, C. T. Nguyen, and K. Najafi, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," in 14th IEEE Int. Microelectromechanical Systems Conf., 2001, pp. 18-21.
28. M. Previti and K. Gilleo, "Getters: Micromolecular scavengers for packaging," in Proc. Int. Advanced Packaging Materials: Processes, Properties, Interfaces Symp., 2001, pp. 201-206.
29. S. Glasstone, Thermodynamics for Chemists. New York: Van Norstand, 1947.
30. Q. Y. Tong and K. Gösele, Semiconductor Wafer Bonding: Science and Technology. New York: Wiley, 1999.
31. M. A. Schmidt, "Wafer-to-wafer bonding for microstructure formation," Proc. IEEE, vol. 86, pp. 1575-1585, Aug. 1998.
32. B. Bokhonov and M. Korchagin, "In-situ investigation of stage of the formation of eutectic alloys in Si-Au and Si-Al systems," J. Alloys and Compounds, no. 312, pp. 238-250, 2000.
33. J. L. Jellison, "Effect of surface contamination on the thermocompression bondability of gold," IEEE Trans. Parts, Hybrids, Packag., vol. PHP-11, pp. 206-211, Sept. 1975.
34. _, "Kinetics of thermocompression bonding to organic contaminated gold surfaces," IEEE Trans. Parts, Hybrids, Packag., vol. PHP-13, pp. 132-137, June 1977.
35. G. DiGiacomo, Reliability of Electronic Packages and Semiconductor Devices. New York: McGraw-Hill, 1997.
36. W. Nelson, Accelerated Testing: Statistical Models, Test Plans, and Data Analyses. New York: Wiley, 1989.
37. W. D. Brown, Advanced Electronic Packaging. New York: IEEE Press, 2000.
38. A. C. Cohen, Truncated and Censored Samples: Theory and Application. New York: Marcel Dekker, 1991.
39. H. Eyring, H. S. Lin, and S. M. Lin, Basic Chemical Kinetics. New York: Wiley, 1980.
40. M. Ohring, Reliability and Failure of Electronic Material and Devices. San Diego, CA: Academic, 1998.
41. S. Peck, "Comprehensive model for humidity testing correlation," in 24th Annu. Proc. Reliability Physics Symp., Anaheim, CA, 1986, pp. 44-50.
42. D. Halliberg and S. Peck, "Recent humidity accelerations, a base for testing standards," Qual. Reliab. Eng. Int., vol. 7, pp. 169-180, 1991.
43. N. Yamazoe and Y. Shimizu, "Humidity sensors: Principles and applications," Sens. Actuators, vol. 10, pp. 379-398, 1986.
44. B. Ziaie, J. A. Von Arx, M. Dokmeci, and K. Najafi, "A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators," J. Microelectromech. Syst., vol. 5, pp. 166-179, Sept. 1996.
45. M. G. Kovac, D. Chleck, and P. Goodman, "A new moisture sensor for in-situ monitoring of sealed package," in Proc. Int. Reliability Physics Symp., 1977, pp. 85-91.