On-chip hermetic packaging enabled by post-deposition electrochemical etching of polysilicon

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 544-547

  He, Rihui ^a   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; ENCAPSULATION; ETCHING; HERMETIC DEVICES; LEAK DETECTION; MICROPROCESSOR CHIPS; POLYSILICON; SILICON WAFERS;

ELECTROCHEMICAL ETCHING; HERMETIC PACKAGING; SURFACE MICROMACHINING; VACUUM SEALING;

ELECTRONICS PACKAGING;

EID: 26844450638     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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