A low cost wafer-level MEMS packaging technology

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 634-637

  Monajemi, Pejman ^a   Joseph, Paul J ^b   Kohl, Paul A ^b   Ayazi, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS PACKAGING; SILICON GYROSCOPES; WAFER BONDING; WAFER-LEVEL ENCAPSULATION;

ENCAPSULATION; GYROSCOPES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; POLYMERS; PYROLYSIS; RESONATORS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

ELECTRONICS PACKAGING;

EID: 26844582092     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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