Localized induction heating solder bonding for wafer level MEMS packaging

Journal of Micromechanics and Microengineering

Volumn 15, Issue 2, 2005, Pages 394-399

  Yang, Hsueh An ^a   Wu, Mingching ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; ELECTROPLATING; INDUCTION HEATING; MAGNETIC THIN FILMS; MICROMACHINING; SILICON WAFERS; SOLDERING; THIN FILMS;

BONDING PROCESS; MICROELECTROMECHANICAL SYSTEMS; SOLDER BONDING; SURFACE MICROMACHINED DEVICES; WAFER LEVEL PACKAGE;

MICROELECTROMECHANICAL DEVICES;

EID: 14244250419     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/2/020     Document Type: Article

References (12)

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