Intrinsic residual stress evolution in thin films during energetic particle bombardment

Engineering Thin Films and Nanostructures with Ion Beams

Volumn , Issue , 2005, Pages 325-392

  Misra, A ^a   Nastasi, M ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33750474135     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Chapter

References (115)

1. M. Nastasi, J.W. Mayer and J.K. Hirvonen, in Ion-Solid Interactions: Fundamentals and Applications, Cambridge University Press, Cambridge, 1996.
2. R.A. Powell and S. Rossnagel, PVD for Microelectronics, 26, Academic Press, 1999.
3. M.F. Doerner and W.D. Nix, in Stress and Deformation Processes in Thin Films on Substrates, CRC Critical Reviews in Solid State Materials Sciences, 14, 225 (1988).
4. R.A. Roy, J.J. Cuomo and D.S. Yee, J. Vac. Sci. Tech., A6, 1621 (1988).
5. D.W. Hoffman, Thin Solid Films, 107, 353 (1983).
6. R. Koch, J. Phys.: Condens. Matter, 6, 9519 (1994).
7. K.N. Tu, J.W. Mayer and L.C. Feldman, Electronic Thin Film Science for Electrical Engineers and Materials Scientists, Macmillan, New York, 1992.
8. M. Ohring, The Materials Science of Thin Films, Academic Press, New York, 1992.
9. G.G. Stoney, Proc. R. Soc. Lond. A, 82, 172 (1909).
10. P.A. Flinn, D.S. Gardner and W.D. Nix, IEEE Trans. Electron Devices, ED-34, 689 (1987).
11. A.I. Van Sambeek and R.S. Averback, Mater. Res. Soc. Symp. Proc., 396, 137 (1996).
12. C.A. Volkert, J. Appl. Phys.,70, 3521 (1991).
13. K. Kinosita, K. Maki, K. Nakamizo and K Takeuchi, Jpn. J. Appl. Phys.,6, 42 (1967).
14. A. Misra, S. Fayeulle, H. Kung, T.E. Mitchell and M. Nastasi, Nucl. Instrum. Methods B, 148, 211 (1999).
15. Y.S. Kim and S.C. Shin, Mater. Res. Soc. Symp. Proc., 382, 285 (1995).
16. A.L. Shull and F. Spaepen, J. Appl. Phys., 80, 6243 (1996).
17. V. Ramaswamy, B.M. Clemens and W.D. Nix, Mater. Res. Soc. Symp. Proc., 528, 161 (1998).
18. B.M. Clemens and J.A. Bain, MRS Bull., July, 46 (1992).
19. H. Dosch, Phys. Rev. B, 35, 2137 (1987).
20. I.C. Noyan and J.B. Cohen, Residual Stress: Measurement by Diffraction and Interpretation, Springer-Verlag, New York, 1987.
21. A. Segmuller and M. Murakami, in H. Herbert (Ed.), Treatise on Materials Science and Technology, 27, 143, Academic Press, New York, 1988.
22. J.J. Cuomo and S.M. Rossnagel, Nucl. Instrum. Methods, B, 19/20, 963 (1987).
23. J.K. Hirvonen, Mater. Sci. Rep., 6, 215 (1991).
24. F.A. Smidt, Int. Mater. Rev., 35, 61 (1990).
25. H. Windishmann, Crit. Rev. Solid State Mater. Sci., 19, 547 (1992).
26. P.Y. Jouan and G. Lemperiere, Vacuum, 42, 927 (1991).
27. S. Kadlec, C. Quaeyhaegens, G. Knuyt and L.M. Stals, Surf. Coat. Technol., 89, 177 (1997).
28. I. Petrov, A. Myers, J.E. Greene and J.R. Abelson, J. Vac. Sci. Technol. A, 12, 2846 (1994).
29. R.E. Somekh, J. Vac. Sci. Technol. A, 2, 1285 (1984).
30. J.H. Rose, J.R. Smith and J. Ferrante, Phys. Rev. B, 28, 1835, (1983); Phys. Rev. Lett., 47, 675 (1981).
31. J.H. Rose, J.R. Smith, F. Guines and J. Ferrante, Phys. Rev. B, 29, 2963 (1984).
32. A. Banerjea and J.R. Smith, Phys. Rev. B, 37, 6632 (1988).
33. J.F. Ziegler, J.P. Biersack and U. Littmark, The Stopping and Range of Ions in Solids, Pergamon Press, New York, 1985.
34. P. Ehrhart, P. Jung, H. Schultz and H. Ullmaier, in Atomic Defects in Metals, Landolt-Bornstein, Group III, 25, Springer- Verlag, Berlin, 1992, Chapter 2.
35. E.S. Machlin, Materials Science in Microelectronics — The Relationships between Thin Film Processing and Structure, vol. 1, GIRO press, New York, 1995, pp 157–184.
36. W.D. Nix and B.M. Clemens, J. Mater. Res., 14, 3467 (1999).
37. C.V. Thompson, J. Mater. Res., 14, 3164 (1999).
38. C.V. Thompson and R. Carel, J. Mech. Phys. Solids, 44, 657 (1996).
39. R.C. Cammarata, T.M. Trimble and D.J. Srolovitz, J. Mater. Res., 15, 2468 (2000).
40. M.A. Phillips, V. Ramaswamy, B.M. Clemens and W.D. Nix, J. Mater. Res., 15, 2540 (2000).
41. J.A. Floro, S.J. Hearne, J.A. Hunter, P. Kotula, E. Chason, S.C. Seal and C.V. Thompson, J. Appl. Phys., 89, 4886 (2001).
42. S.C. Seel, C.V. Thompson, S.J. Hearne and J.A. Floro, J. Appl. Phys.,88, 7079 (2000).
43. L.B. Freund and E. Chason, J. Appl. Phys., 89, 4866 (2001).
44. E. Chason, B.W. Sheldon, L.B. Freund, J.A. Floro and S.J. Hearne, Phys. Rev. Lett., 88, 156103, (2002).
45. B.W. Sheldon, K.H.A. Lau, and A. Rajamani, J. Appl. Phys., 90, 5097 (2001).
46. A. Misra, H. Kung, T.E. Mitchell and M. Nastasi, J. Mater. Res., 15, 756 (2000).
47. R.C. Cammarata and K. Sieradzki, Annu. Rev. Mxater. Sci., 24, 215 (1994).
48. F. Spaepen, Acta Mater., 48, 31 (2000).
49. R.C. Cammarata, K. Sieradzki and F. Spaepen, J. Appl. Phys., 87, 1227 (2000).
50. D.P. Adams, L.J. Parfitt, J.C. Billelo, S.M. Yalisove and Z.U. Rek, Thin Solid Films, 266, 52 (1995).
51. A. Misra, S. Fayeulle, H. Kung, T.E. Mitchell and M. Nastasi, Appl. Phys. Lett. 73, 891 (1998).
52. A. Misra and M. Nastasi, J. Mater. Res., 14, 4466 (1999).
53. A. Misra and M. Nastasi, Appl. Phys. Lett., 75, 3123 (1999).
54. A. Misra and M. Nastasi, J. Vac. Sci. Technol. A, 18, 2517 (2000).
55. A. Misra and M. Nastasi, Nucl. Inst. Methods B, 175/177, 688 (2001).
56. A. Misra and M. Nastasi, in K.L. Mittal (Ed.), Adhesion Aspects of Thin Films, vol. 1, 2001, pp. 17–29.
57. J.N. Ness, W.M. Stobbs and T.F. Page, Phil. Mag. A, 54, 679 (1986).
58. C.R.M. Grovenor, H.T.G. Hentzell and D.A. Smith, Acta Metall., 32, 773 (1984).
59. R.W. Hoffman, Thin Solid Films, 34, 185 (1976).
60. K.H. Müller, J. Appl. Phys., 62, 1796 (1987).
61. K.H. Müller, J. Appl. Phys., 59, 2803 (1986).
62. K.H. Müller, Phys. Rev. B, 35, 7906 (1987).
63. R. Mitra, R.A. Hoffman, A. Madan and J.R. Weertman, J. Mater. Res., 16, 1010 (2001).
64. L.A. Girifalco and V.G. Weizer, Phys. Rev., 114, 687 (1959).
65. M. Itoh, M. Hori and S. Nadahara, J. Vac. Sci. Technol. B, 9, 149 (1991).
66. R.G. Hoagland, LANL, unpublished work.
67. J.A. Sprague, NRL, unpublished work.
68. H. Windischmann, J. Appl. Phys., 62, 1800 (1987).
69. C.A. Davis, Thin Solid Films, 226, 30 (1993).
70. G. Knuyt, W. Lauwerens, L.M. Stals, Thin Solid Films, 370, 232 (2000).
71. M.T. Robinson, Phil. Mag. 12, (1965) 741.
72. M.T. Robinson and O.S. Oen, J. Nucl. Mater., 110, 147 (1982).
73. P. Sigmund, Radiat. Eff., 1, 15 (1969).
74. D.J. Bacon, A.F. Calder and F. Cao, Radiat. Eff. Def. Solids, 141, 283 (1997).
75. A.B. Lidiard and R. Perrin, Phil. Mag., 14, 49 (1973).
76. A. Jain, S. Loganathan and U. Jain, Nucl. Inst. Methods B, 127/128, 43 (1997).
77. B.M. Clemens, H. Kung and S.A. Barnett, MRS Bull., 24, 20 (1999).
78. A. Misra and H. Kung, Adv. Eng. Mater., 3, 217 (2001).
79. J.D. Embury and J.P. Hirth, Acta Metall., 42, 2051 (1994).
80. W.D. Nix, Scripta Mater., 39, 545 (1998).
81. A. Misra, J.P. Hirth and H. Kung, Phil. Mag. A, 82, 2935 (2002).
82. C.V. Thompson, J. Mater. Res., 8, 237 (1993).
83. R.L. Fleischer, in D. Peckner (Ed.), The Strengthening of Metals, Reinhold Press, New York, 1964, pp. 93–162.
84. B. Window, F. Sharples and N. Savvides, J. Vac. Sci. Technol. A, 6, 2333 (1988).
85. J.W. Mayer and S.S. Lau, in J.M. Poate, G. Foti and D.C. Jacobson (Eds.), Surface Modification and Alloying by Laser, Ion, and Electron Beams, Plenum Press, New York, 1983, p. 241.
86. B.M. Paine and R.S. Averback, Nucl. Instrum. Methods B, 7/8 (1985) 666.
87. F.W. Saris, in C.J. McHargue, R. Kossowsky and W.O. Hofer (Eds.), Structure–Property Relationships in Surface-Modified Ceramics, Kluwer Academic Publishers, Dordrecht, 1989, p. 103.
88. Y.-T. Cheng, Mater. Sci. Rep., 5 (1990) 45.
89. A. Gras-Marti and U. Littmark, in R. Kelly and M.F. da Silva (Eds.), Materials Modification by High-Fluence Ion Beams, Kluwer Academic, Dordrecht, 1987, p. 257.
90. M. Nastasi and J.W. Mayer, Mater. Sci. Eng., R12, 1 (1994).
91. W. Bolse, Mater. Sci. Eng., R12, 53 (1994).
92. H.H. Andersen, Appl. Phys., 18, 131 (1979).
93. P. Sigmund and A. Gras-Marti, Nucl. Instrum. Methods, 182/183, 25 (1981).
94. W.L. Johnson, Y.-T. Cheng, M. Van Rossum and M.-A. Nicolet, Nucl. Instrum. Methods B, 7/8, 657 (1985).
95. R. Kelly and A. Miotello, Surf. Coat. Technol., 51, 343 (1992).
96. A. Miotello and R. Kelly, Thin Solid Films, 241, 192 (1994).
97. A. Miotello and R. Kelly, Surf. Sci., 314, 275 (1994).
98. P. Sigmund and N.Q. Lam, Mater. Fys. Medd. K. Dan. Vidensk. Selsk., 43, 255, (1993).
99. L.C. Wei and R.S. Averback, J. Appl. Phys.,81, 613 (1997).
100. J.L. Bocquet, G. Brebec and Y. Limoge, in R.W. Cahn and P. Haasen (Eds.), Physical Metallurgy, North-Holland, Amsterdam, 1983, p. 385.
101. M. Nastasi, S. Fayeulle, Y.-C. Lu and H. Kung, Mater. Sci. Eng. A, 253, 202 (1998).
102. D.R. Brighton and G.K. Hubler, Nucl. Instrum. Methods B, 28, 527 (1987).
103. E.H. Hirsch and I.K. Varga, Thin Solid Films, 52, 445 (1978).
104. H. Trinkaus, J. Nucl. Mater., 223, 196 (1995).
105. M.L. Brongersma, E. Snoeks, T. van Dillen and A. Polman, J. Appl. Phys., 88, 59 (2000).
106. S.G. Mayr and R.S. Averback, Phys. Rev. Lett., 87, 6106 (2001).
107. A. Jain and U. Jain, Thin Solid Films, 256, 116 (1995).
108. A. Jain, Surf. Coat. Technol., 104, 20 (1998).
109. H.U. Krebs, Y. Luo, M. Stormer, A. Crespo, P. Schaaf and W. Bolse, Appl. Phys. A, 61, 591 (1995).
110. G. Gladyszewski, Ph. Goudeau, A. Naudon, C. Jaouen and J. Pacaud, Appl. Surf. Sci., 65/66, 28 (1993).
111. L. Pranevicius, K.F. Badawi, N. Durand, J. Delafond and Ph. Goudeau, Surf. Coat. Technol., 71, 254, (1995).
112. S. Tamulevicius, I. Pozela and J. Jankauskas, J. Phys. D: Appl. Phys., 31, 2991 (1998).
113. E. Snoeks, K.S. Boutros and J. Barone, J. Appl. Phys. Lett., 71, 267 (1997).
114. C. Hardtke, W. Schilling and H. Ullmaier, Nucl. Instrum. Methods B, 59/60, 377 (1991).
115. C. Hardtke, H. Ullmaier, W. Schilling and M. Gebauer, Thin Solid Films, 175, 61 (1989).