Reflowable Anisotropic Conductive adhesives for flipchip packaging

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 259-262

  Sea, T Y ^a   Tan, T C ^a   Peh, E K ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; FLIP CHIP DEVICES; PLASTIC ADHESIVES; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA);

ELECTRONICS PACKAGING;

EID: 0031313819     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)