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Volumn 23, Issue 1, 2000, Pages 15-21

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CONDUCTIVE MATERIALS; ELASTICITY; ELECTRIC CONDUCTANCE; ELECTRIC CONTACTS; ELECTRIC RESISTANCE MEASUREMENT; FILLER METALS; MATHEMATICAL MODELS; PLASTIC DEFORMATION;

EID: 0033901725     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.826757     Document Type: Article
Times cited : (43)

References (8)
  • 2
    • 33749933571 scopus 로고    scopus 로고
    • Modeling of electrical conduction for conductive adhesives," in
    • 99, Int., InterSoc., Electron. Packag. TechJBus. Conf. Exhibition, Maui, HI, June 13-17, 1999.
    • J. Morris Modeling of electrical conduction for conductive adhesives," in Proc. InterPACK'99, Int., InterSoc., Electron. Packag. TechJBus. Conf. Exhibition, Maui, HI, June 13-17, 1999.
    • Proc. InterPACK'
    • Morris, J.1
  • 4
    • 0030212322 scopus 로고    scopus 로고
    • Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates,"
    • vol. 19, pp. 664-660, Aug. 1996.
    • Z. Lai and J. Liu Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 19, pp. 664-660, Aug. 1996.
    • IEEE Trans. Comp., Packag., Manufact. Technol. B
    • Lai, Z.1    Liu, J.2
  • 5
    • 0031098258 scopus 로고    scopus 로고
    • Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations,"
    • vol. 20, pp. 21-30, Mar. 1997.
    • J. Liu, K. Gustafsson, Z. Lai, and C. Li Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 20, pp. 21-30, Mar. 1997.
    • IEEE Trans. Comp., Packag., Manufact. Technol. a
    • Liu, J.1    Gustafsson, K.2    Lai, Z.3    Li, C.4
  • 6
    • 0032090589 scopus 로고    scopus 로고
    • Quantitative estimation of the characteristics of conductive particles in ACA by using Nano indentor,"
    • vol. 21, pp. 248-251, June 1998.
    • X. Wang, Y. Wang, G. Chen, J. Liu, and Z. Lai Quantitative estimation of the characteristics of conductive particles in ACA by using Nano indentor," IEEE Comp., Packag., Manufact. Technol. A, vol. 21, pp. 248-251, June 1998.
    • IEEE Comp., Packag., Manufact. Technol. a
    • Wang, X.1    Wang, Y.2    Chen, G.3    Liu, J.4    Lai, Z.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.