Mechanism of electrical conduction through anisotropically conductive adhesive films

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 546-553

  Mizuno, Masuo ^a   Saka, Masumi ^b   Abé, Hiroyuki ^b  

^a Sumitomo Bakelite Co Ltd ^*  (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Anisotropically conductive adhesive film; Electrical resistance; Electrically conductive particle; High temperature and high humidity treatment; Insulating particle; Mechanism of electrical conduction; Particle content; Temperature cycle treatment

Indexed keywords

ADHESIVES; ANISOTROPY; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC INSULATING MATERIALS; ELECTRIC RESISTANCE; HIGH TEMPERATURE EFFECTS; INTEGRATED CIRCUIT MANUFACTURE; SUBSTRATES;

ANISOTROPICALLY CONDUCTIVE ADHESIVE FILMS (ACF); FLEXIBLE PRINTED CIRCUIT (FPC); TAPE CARRIER PACKAGE (TCP);

CONDUCTIVE FILMS;

EID: 0030406403     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554936     Document Type: Article

References (6)

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