Analysis of ACA/ACF package using equivalent spring method

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 110-116

  Chiang, K N ^a   Chang, C W ^a   Lin, J D ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Anisotropic conductive films; Assembly; Conductive adhesives; Flat panel displays; Packaging; Polymer films; Resins; Springs; Tensile stress; Thermal force

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; ANISOTROPY; ASSEMBLY; CHIP SCALE PACKAGES; ELECTRIC LOSSES; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; FLAT PANEL DISPLAYS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; METAL COATINGS; PACKAGING; POLYMER FILMS; RESINS; SPRINGS (COMPONENTS); TENSILE STRESS;

ANISOTROPIC CONDUCTIVE FILMS; CONDUCTIVE ADHESIVE; ENVIRONMENTAL COMPATIBILITY; FLIP-CHIP INTERCONNECTION; METAL-COATED POLYMERS; NONLINEAR FINITE ELEMENT SIMULATION; PERFORMANCE AND RELIABILITIES; THERMAL FORCES;

CONDUCTIVE FILMS;

EID: 0042913678     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906358     Document Type: Conference Paper

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