Smart cards and smart labels-high volume applications of adhesive flip-chip technologies

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 52-54

  Seidowski, Th ^a   Kriebel, F ^a   Galties, J ^a  

^a KSW Microtec GmbH   (Germany)

Author keywords

Assembly; Conductive adhesives; Costs; Independent component analysis; Mass production; Metallization; Packaging; Palladium; Smart cards; Throughput

Indexed keywords

ADHESIVES; ASSEMBLY; CHIP SCALE PACKAGES; COATINGS; COST BENEFIT ANALYSIS; COSTS; FLIP CHIP DEVICES; INDEPENDENT COMPONENT ANALYSIS; JOINING; LABELS; MANUFACTURE; METALLIZING; METALS; PACKAGING; PALLADIUM; REELS; RETAIL STORES; SMART CARDS; THROUGHPUT; TRANSPORTATION;

ANISOTROPIC CONDUCTIVE ADHESIVES; CONDUCTIVE ADHESIVE; ENVIRONMENTAL FRIENDLINESS; FLIP CHIP TECHNOLOGIES; ISOTROPIC CONDUCTIVE ADHESIVES; MASS PRODUCTION; NON-CONDUCTIVE ADHESIVES; UNDER BUMP METALLIZATION;

ADHESIVE JOINTS;

EID: 15744371240     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860572     Document Type: Conference Paper

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