A new anisotropic conductive film with arrayed conductive particles

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 4, 1996, Pages 752-757

  Ishibashi, Kazuo ^a   Kimura, Jun ^a  

^a AMP Technology Japan Ltd   (Japan)

Author keywords

Anisotropic conductive adhesive film; Anisotropie conductive film; Conductive particles; Contact resistance; Current carrying capacity; Electroforming; Fine pitch interconnection; Insulation resistance; Photolithography; Thermocompression bonding

Indexed keywords

ANISOTROPY; CATHODES; ELECTRIC CURRENT CARRYING CAPACITY (CABLES); ELECTRIC INSULATION; ELECTRIC RESISTANCE; ELECTROFORMING; PHOTOLITHOGRAPHY; PHOTORESISTS; SOLDERING; SUBSTRATES;

ANISOTROPIC CONDUCTIVE ADHESIVE FILM; ANISOTROPIC CONDUCTIVE FILM; METAL CONDUCTOR ARRAY; THERMOCOMPRESSION BONDING;

CONDUCTIVE FILMS;

EID: 0030286667     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.544366     Document Type: Article

References (3)

1. D. D. Chang, P. A. Crawford, J. A. Fulton, R. McBride, M. B. Schmidt, R. E. Sinitski, and C. P. Wong, "An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, no. 8, pp. 828-835, Dec. 1993.
2. N. R. Basavanhally, D. D. Chang, and B. H. Cranston, "Direct chip interconnect with adhesive-connector films," in Proc. Electron. Comp. Technol. Conf., May 18-20, 1992, pp. 487-491.
3. S. Jin, T. H. Tiefel, L. Chen, and D. W. Dahringer, "Anisotropically conductive polymer films with a uniform dispersion of particles," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, no. 8, pp. 972-977, Dec. 1993.