-
1
-
-
0006807833
-
-
Henley Publishing, London
-
R. Mohondro, Semiconductor Fabtech, Issue No. 3, Henley Publishing, London, 1995, pp. 177-183.
-
(1995)
Semiconductor Fabtech
, Issue.3
, pp. 177-183
-
-
Mohondro, R.1
-
3
-
-
84875460155
-
International technology roadmap for semiconductors
-
SEMATECH 2004, "International Technology Roadmap for Semiconductors" in http://public.itrs.net/Files/2003ITRS/Home2003.htm.
-
SEMATECH 2004
-
-
-
5
-
-
0026838171
-
-
U.S. Tandon, Vacuum 1992, 43, 241-251.
-
(1992)
Vacuum
, vol.43
, pp. 241-251
-
-
Tandon, U.S.1
-
6
-
-
0001429835
-
-
J. Melngailis, A. A. Mondelli, I. L. Berry, R. Mohondro, J. Vac. Sci. Technol. B 1998, 16, 927-957.
-
(1998)
J. Vac. Sci. Technol. B
, vol.16
, pp. 927-957
-
-
Melngailis, J.1
Mondelli, A.A.2
Berry, I.L.3
Mohondro, R.4
-
8
-
-
0033347813
-
-
IEEE
-
Y. Lee, K. N. Leung, M. D. Williams, W. H. Brunger, W. Fallmann, H. Loeschner, G. Stengl, Proc. IEEE 1999 Particle Accelerator Conference, IEEE, 1999, pp. 2575-2577.
-
(1999)
Proc. IEEE 1999 Particle Accelerator Conference
, pp. 2575-2577
-
-
Lee, Y.1
Leung, K.N.2
Williams, M.D.3
Brunger, W.H.4
Fallmann, W.5
Loeschner, H.6
Stengl, G.7
-
9
-
-
0041620435
-
-
H. Loeschner, E. J. Fantner, R. Korntner, E. Platzgummer, G. Stengl, M. Zeininger, R. Berger, W. M. Brunger, A. Dietzel, M.-I. Baraton, L. Merharl, J. E. E. Baglin, Mater. Res. Soc. Symp. Proc. 2002, 739, 3-12.
-
(2002)
Mater. Res. Soc. Symp. Proc.
, vol.739
, pp. 3-12
-
-
Loeschner, H.1
Fantner, E.J.2
Korntner, R.3
Platzgummer, E.4
Stengl, G.5
Zeininger, M.6
Berger, R.7
Brunger, W.M.8
Dietzel, A.9
Baraton, M.-I.10
Merharl, L.11
Baglin, J.E.E.12
-
12
-
-
12244269688
-
-
K. Kimura, K. Nakajima, H. Kobayashi, S. Miwa, K. Satori, Appl. Surf. Sci. 2003, 203/204, 418-422.
-
(2003)
Appl. Surf. Sci.
, vol.203-204
, pp. 418-422
-
-
Kimura, K.1
Nakajima, K.2
Kobayashi, H.3
Miwa, S.4
Satori, K.5
-
14
-
-
31244434082
-
-
M. Klcinska-Habior, Z. Trznadel, O, Kijewska, E. Wojcik, Acta Phys. Pol. B 2002, 33, 949-956.
-
(2002)
Acta Phys. Pol. B
, vol.33
, pp. 949-956
-
-
Klcinska-Habior, M.1
Trznadel, Z.2
Kijewska, O.3
Wojcik, E.4
-
15
-
-
0022579554
-
-
G. Stengl, H. Loeschner, M. Maurer, P. Wolf, J. Vac. Sci. Technol. B 1986, 4, 194-200.
-
(1986)
J. Vac. Sci. Technol. B
, vol.4
, pp. 194-200
-
-
Stengl, G.1
Loeschner, H.2
Maurer, M.3
Wolf, P.4
-
16
-
-
0029251808
-
-
W. H. Brunger, H. Loeschner, G. Stengl, W. Fallmann, W. Finkelstein, J. Melngailis, Microelectron. Eng. 1995, 27, 323-326.
-
(1995)
Microelectron. Eng.
, vol.27
, pp. 323-326
-
-
Brunger, W.H.1
Loeschner, H.2
Stengl, G.3
Fallmann, W.4
Finkelstein, W.5
Melngailis, J.6
-
18
-
-
0030824495
-
-
Y. Lee, R. A. Gough, W. B. Kunkel, K. N. Leung, L. T. Perkins, D. S. Pickard, L. Sun, J. Vujic, M. D. Williams, D. Wutte, A. A. Mondelli, G. Stengl, Nucl. Instrum. Methods Phys. Res. Sect. A 1997, 385, 204-208.
-
(1997)
Nucl. Instrum. Methods Phys. Res. Sect. A
, vol.385
, pp. 204-208
-
-
Lee, Y.1
Gough, R.A.2
Kunkel, W.B.3
Leung, K.N.4
Perkins, L.T.5
Pickard, D.S.6
Sun, L.7
Vujic, J.8
Williams, M.D.9
Wutte, D.10
Mondelli, A.A.11
Stengl, G.12
-
20
-
-
0035450771
-
-
R. Kaesmaier, A. Ehrmann, H. Loschner, Microelectron. Eng. 2001, 57-58, 145-153.
-
(2001)
Microelectron. Eng.
, vol.57-58
, pp. 145-153
-
-
Kaesmaier, R.1
Ehrmann, A.2
Loschner, H.3
-
22
-
-
0010518557
-
-
L. L. Berry, A. A. Mondelli, J. Nichols, J. Melngailis, J. Vac. Sci. Technol. B 1997, 15, 2382-2386.
-
(1997)
J. Vac. Sci. Technol. B
, vol.15
, pp. 2382-2386
-
-
Berry, L.L.1
Mondelli, A.A.2
Nichols, J.3
Melngailis, J.4
-
23
-
-
0942267579
-
-
V. V. Ngo, B. Akker, K. N. Leung, I. Noh, K. L. Scott, S. Wilde, J. Vac. Sci. Technol. B 2003, 21, 2297-2303.
-
(2003)
J. Vac. Sci. Technol. B
, vol.21
, pp. 2297-2303
-
-
Ngo, V.V.1
Akker, B.2
Leung, K.N.3
Noh, I.4
Scott, K.L.5
Wilde, S.6
-
24
-
-
0942278347
-
-
X. Jiang, Q. Ji, L. Ji, A. Chang, K. N. Leung, J. Vac. Sci. Technol. B 2003, 21, 2724-2727.
-
(2003)
J. Vac. Sci. Technol. B
, vol.21
, pp. 2724-2727
-
-
Jiang, X.1
Ji, Q.2
Ji, L.3
Chang, A.4
Leung, K.N.5
-
25
-
-
0242302428
-
-
A. A. Tseng, K. Chen, C. D. Chen, K. J. Ma, IEEE Trans. Electron. Packag. Manuf. 2003, 26, 141-149.
-
(2003)
IEEE Trans. Electron. Packag. Manuf.
, vol.26
, pp. 141-149
-
-
Tseng, A.A.1
Chen, K.2
Chen, C.D.3
Ma, K.J.4
-
26
-
-
33745483745
-
-
E. J. Parma, R. R. Hart, J. L. Bartelt, J. Vac. Sci. Technol. B 1987, 5, 228-231.
-
(1987)
J. Vac. Sci. Technol. B
, vol.5
, pp. 228-231
-
-
Parma, E.J.1
Hart, R.R.2
Bartelt, J.L.3
-
27
-
-
0000956641
-
-
S.V. Pendharkar, J. C. Wolfe, H. R. Rampersad, Y. L. Chau, D. L. Licon, M. D. Morgan, W. E. Horne, R. C. Tiberlo, J. N. Randall, J. Vac. Sci. Technol. B 1995, 13, 2588-2592.
-
(1995)
J. Vac. Sci. Technol. B
, vol.13
, pp. 2588-2592
-
-
Pendharkar, S.V.1
Wolfe, J.C.2
Rampersad, H.R.3
Chau, Y.L.4
Licon, D.L.5
Morgan, M.D.6
Horne, W.E.7
Tiberlo, R.C.8
Randall, J.N.9
-
28
-
-
0034316298
-
-
B. Volland, F. Shi, H. Heerlein, I.W. Rangelow, P. Hudek, I. Kostic, E. Cekan, H. Vonach, H. Loeschner, C. Horner, G. Stengl, M. Buschbeck, M. Zeininger, A. Sleeker, J. Benschop, J. Vac. Sci. Technol. B 2000, 18, 3202-3206.
-
(2000)
J. Vac. Sci. Technol. B
, vol.18
, pp. 3202-3206
-
-
Volland, B.1
Shi, F.2
Heerlein, H.3
Rangelow, I.W.4
Hudek, P.5
Kostic, I.6
Cekan, E.7
Vonach, H.8
Loeschner, H.9
Horner, C.10
Stengl, G.11
Buschbeck, M.12
Zeininger, M.13
Sleeker, A.14
Benschop, J.15
-
30
-
-
0034206883
-
-
F. Letzkus, J. Butschke, B. Höfflinger, M. Irmscher, C. Reuter, R. Springer, A. Ehrmann, J. Mathuni, Microelectron. Eng. 2000, 53, 609-612.
-
(2000)
Microelectron. Eng.
, vol.53
, pp. 609-612
-
-
Letzkus, F.1
Butschke, J.2
Höfflinger, B.3
Irmscher, M.4
Reuter, C.5
Springer, R.6
Ehrmann, A.7
Mathuni, J.8
-
31
-
-
0036883215
-
-
J. L. Torres, J. C. Wolfe, P. Ruchhoeft, T. F. Kennedy, J. Podolski, K. Kragler, A. Ehrmann, R. Kaesmaier, H. Loeschner, J. Vac. Sci. Technol. B 2002, 20, 3095-3098.
-
(2002)
J. Vac. Sci. Technol. B
, vol.20
, pp. 3095-3098
-
-
Torres, J.L.1
Wolfe, J.C.2
Ruchhoeft, P.3
Kennedy, T.F.4
Podolski, J.5
Kragler, K.6
Ehrmann, A.7
Kaesmaier, R.8
Loeschner, H.9
-
32
-
-
0033132696
-
-
R. Tejeda, G. Frisque, R. Engelstad, E. Lovell, E. Haugeneder, H. Loeschner, Microelectron. Eng. 1999, 46, 485-488.
-
(1999)
Microelectron. Eng.
, vol.46
, pp. 485-488
-
-
Tejeda, R.1
Frisque, G.2
Engelstad, R.3
Lovell, E.4
Haugeneder, E.5
Loeschner, H.6
-
33
-
-
3843051808
-
-
H. Loeschner, G. Stengl, H. Buschbeck, A. Chalupka, G. Lammer, E. Platzgummer, H. Vonach, P.W. H. de Jager, R. Kaesmaier, A. Ehrmann, S. Hirscher, A. Wolter, A. Dietzel, R. Berger, H. Grimm, B. D. Terris, W. H. Bruenger, G. Gross, O. Fortagne, D. Adam, M. Böhrn, H. Eichhorn, R. Springer, J. Butschke, F. Letzkus, P. Ruchhoeft, J. C. Wolfe, J. Microllthogr. Microfabr. Microsyst. 2003, 2, 34-48.
-
(2003)
J. Microllthogr. Microfabr. Microsyst.
, vol.2
, pp. 34-48
-
-
Loeschner, H.1
Stengl, G.2
Buschbeck, H.3
Chalupka, A.4
Lammer, G.5
Platzgummer, E.6
Vonach, H.7
De Jager, P.W.H.8
Kaesmaier, R.9
Ehrmann, A.10
Hirscher, S.11
Wolter, A.12
Dietzel, A.13
Berger, R.14
Grimm, H.15
Terris, B.D.16
Bruenger, W.H.17
Gross, G.18
Fortagne, O.19
Adam, D.20
Böhrn, M.21
Eichhorn, H.22
Springer, R.23
Butschke, J.24
Letzkus, F.25
Ruchhoeft, P.26
Wolfe, J.C.27
more..
-
34
-
-
0037754904
-
-
J. Riordon, L. Didenko, J. Melngailis, J. Vac. Sci. Technol. B 1996, 34, 3900-3901.
-
(1996)
J. Vac. Sci. Technol. B
, vol.34
, pp. 3900-3901
-
-
Riordon, J.1
Didenko, L.2
Melngailis, J.3
-
35
-
-
0034318268
-
-
J. L. Torres, H. N. Nounu, J. R. Wasson, J. C. Wolfe, J. Lutz, E. Haugeneder, H. Loeschner, G. Stengl, R. Kaesmaier, J. Vac. Sci. Technol. B 2000, 18, 3207-3209.
-
(2000)
J. Vac. Sci. Technol. B
, vol.18
, pp. 3207-3209
-
-
Torres, J.L.1
Nounu, H.N.2
Wasson, J.R.3
Wolfe, J.C.4
Lutz, J.5
Haugeneder, E.6
Loeschner, H.7
Stengl, G.8
Kaesmaier, R.9
-
36
-
-
0037207690
-
-
D. Braun, R. Gajic, F. Kuchar, R. Korntner, E. Haugeneder, H. Loeschner, J. Butschke, F. Letzkus, R. Springer, J. Vac. Sci. Technol. B 2003, 21, 123-126.
-
(2003)
J. Vac. Sci. Technol. B
, vol.21
, pp. 123-126
-
-
Braun, D.1
Gajic, R.2
Kuchar, F.3
Korntner, R.4
Haugeneder, E.5
Loeschner, H.6
Butschke, J.7
Letzkus, F.8
Springer, R.9
-
37
-
-
0030418096
-
-
A. A. Tseng, J. Muller, Y. H. Hahn, Mater. Des. 1996, 17, 89-96.
-
(1996)
Mater. Des.
, vol.17
, pp. 89-96
-
-
Tseng, A.A.1
Muller, J.2
Hahn, Y.H.3
-
38
-
-
0033275058
-
-
W. H. Brunger, M. Torkler, M. Weiss, H. Loeschner, K. Leung, Y. Lee, P. Hudek, I.W. Rangelow, G. Stangl, W. Fallmann, J. Vac. Sci. Technol. B 1999, 17, 3119-3121.
-
(1999)
J. Vac. Sci. Technol. B
, vol.17
, pp. 3119-3121
-
-
Brunger, W.H.1
Torkler, M.2
Weiss, M.3
Loeschner, H.4
Leung, K.5
Lee, Y.6
Hudek, P.7
Rangelow, I.W.8
Stangl, G.9
Fallmann, W.10
-
39
-
-
17344379483
-
-
K. Arshak, M. Mihov, A. Arshak, D. McDonagh, D. Sutton, Microelectron. Eng., 2004, 73-74, 144-151.
-
(2004)
Microelectron. Eng.
, vol.73-74
, pp. 144-151
-
-
Arshak, K.1
Mihov, M.2
Arshak, A.3
McDonagh, D.4
Sutton, D.5
-
40
-
-
0005065256
-
-
ICG Publishing, London
-
E. Richter, M. Sebald, L. Chen, G. Schmid, G. Zech, Semiconductor Fabtech, Issue No. 14, ICG Publishing, London, 2002, pp. 137-142.
-
(2002)
Semiconductor Fabtech
, Issue.14
, pp. 137-142
-
-
Richter, E.1
Sebald, M.2
Chen, L.3
Schmid, G.4
Zech, G.5
-
41
-
-
85087580481
-
-
W. H. Brunger, M. Torkler, L. M. Buchmann, J. Vac. Sci. Technol. B 1997, 35, 2355-2357.
-
(1997)
J. Vac. Sci. Technol. B
, vol.35
, pp. 2355-2357
-
-
Brunger, W.H.1
Torkler, M.2
Buchmann, L.M.3
-
42
-
-
0035450654
-
-
S. Hirscher, R. Kaesmaier, W. D. Domke, A. Wolter, H. Loeschner, E. Cekan, C. Horner, M. Zeininger, J. Ochsenhirt, Microelectron. Eng. 2001, 57-58, 517-524.
-
(2001)
Microelectron. Eng.
, vol.57-58
, pp. 517-524
-
-
Hirscher, S.1
Kaesmaier, R.2
Domke, W.D.3
Wolter, A.4
Loeschner, H.5
Cekan, E.6
Horner, C.7
Zeininger, M.8
Ochsenhirt, J.9
-
43
-
-
0035519441
-
-
H. Loeschner, G. Stengl, R. Kaesmaier, A. Wolter, J. Vac. Sci. Technol. B 2001, 19, 2520-2524.
-
(2001)
J. Vac. Sci. Technol. B
, vol.19
, pp. 2520-2524
-
-
Loeschner, H.1
Stengl, G.2
Kaesmaier, R.3
Wolter, A.4
-
44
-
-
0034205525
-
-
W. H. Brunger, M. Torkler, C. Dzionk, B. D. Terris, L. Folks, D. Weller, H. Rothuizen, P. Vettiger, G. Stangl, W. Fallmann, Microelectron. Eng. 2000, 53, 605-608.
-
(2000)
Microelectron. Eng.
, vol.53
, pp. 605-608
-
-
Brunger, W.H.1
Torkler, M.2
Dzionk, C.3
Terris, B.D.4
Folks, L.5
Weller, D.6
Rothuizen, H.7
Vettiger, P.8
Stangl, G.9
Fallmann, W.10
-
45
-
-
0036762293
-
-
A. Dietzel, R. Berger, H. Grimm, W. H. Brunger, C. Dzionk, F. Letzkus, R. Springer, H. Loeschner, E. Platzgummer, G. Stengl, Z. Z. Bandic, B. D. Terris, IEEE Trans. Magn. 2002, 38, 1952-1954.
-
(2002)
IEEE Trans. Magn.
, vol.38
, pp. 1952-1954
-
-
Dietzel, A.1
Berger, R.2
Grimm, H.3
Brunger, W.H.4
Dzionk, C.5
Letzkus, F.6
Springer, R.7
Loeschner, H.8
Platzgummer, E.9
Stengl, G.10
Bandic, Z.Z.11
Terris, B.D.12
-
46
-
-
0042661010
-
-
A. Dietzel, R. Berger, H. Loeschner, G. Stengl, W. H. Brunger, F. Leizkus, Adv. Mater. 2003, 15, 1152-1155.
-
(2003)
Adv. Mater.
, vol.15
, pp. 1152-1155
-
-
Dietzel, A.1
Berger, R.2
Loeschner, H.3
Stengl, G.4
Brunger, W.H.5
Leizkus, F.6
-
47
-
-
0036643935
-
-
W. H. Brunger, C. Dzionk, R. Berger, H. Grimm, A. Dietzel, F. Letzkus, R. Springer, Microelectron. Eng. 2002, 61-62, 295-300.
-
(2002)
Microelectron. Eng.
, vol.61-62
, pp. 295-300
-
-
Brunger, W.H.1
Dzionk, C.2
Berger, R.3
Grimm, H.4
Dietzel, A.5
Letzkus, F.6
Springer, R.7
-
48
-
-
0036883150
-
-
A. Spiegel, W. H. Brunger, C. Dzionk, P. Schmuki, J. Vac. Sci. Technol. B 2002, 20, 2713-2716.
-
(2002)
J. Vac. Sci. Technol. B
, vol.20
, pp. 2713-2716
-
-
Spiegel, A.1
Brunger, W.H.2
Dzionk, C.3
Schmuki, P.4
-
49
-
-
0036565638
-
-
T. Shibata, K. Suguro, K. Sugihara, T. Nishihashi, J. Fujiyama, Y. Sakurada, IEEE Trans. Semicond. Manuf. 2002, 15, 183-188.
-
(2002)
IEEE Trans. Semicond. Manuf.
, vol.15
, pp. 183-188
-
-
Shibata, T.1
Suguro, K.2
Sugihara, K.3
Nishihashi, T.4
Fujiyama, J.5
Sakurada, Y.6
-
50
-
-
0036891850
-
-
W. He, D. B. Poker, K. E. Gonsalves, N. Batina, Microelectron. Eng. 2002, 65, 153-161.
-
(2002)
Microelectron. Eng.
, vol.65
, pp. 153-161
-
-
He, W.1
Poker, D.B.2
Gonsalves, K.E.3
Batina, N.4
|