On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the micro scale

Meccanica

Volumn 40, Issue 4-6 SPEC. ISS., 2005, Pages 485-503

  Corigliano, Alberto ^a   Cacchione, Fabrizio ^a   De Masi, Biagio ^b   Riva, Caterina ^b  

^a POLITECNICO DI MILANO   (Italy)

^b STMICROELECTRONICS   (Italy)

Author keywords

Mechanical properties; MEMS; Polysilicon; Weibull statistics

Indexed keywords

BENDING (DEFORMATION); CAPACITORS; ELASTIC MODULI; ELECTROSTATICS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; STRESS ANALYSIS;

MEMS; WEIBULL STATISTICS;

POLYSILICON;

EID: 29144507364     PISSN: 00256455     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11012-005-2135-9     Document Type: Article

References (36)

1. Senturia, S.D., Microsystem Design, Kluwer Acadamic Publishers, Dordrecht, 2001.
2. Gardner, J.W., Varadan, V.K. and Awadelkarim, O.O., Microsensors MEMS and Smart Devices, Wiley, Chichester, 2001.
3. Lyshevski, S.E., MEMS and NEMS. Systems, Devices and Structures. CRC Press, New York, London, 2002.
4. Madou, M.J., Fundamentals of Microfabrication, CRC Press, New York, London, 2002.
5. Prorok, B.C., Zhu, Y., Espinosa, H.D., Guo, Z., Bažant, Z., Zhao, Y. and Yakobson, B.I., 'Micro and Nanomechanics', in: Nalwa, H.S. (ed.), Encyclopedia of Nanoscience and Nanotechnology, Vol. 5, 2004, pp. 555-600.
6. Greek, S., Ericson, F., Johansson, S. and Schweitz, J.A., 'In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures', Thin Solid Films 292 (1997) 247-254.
7. Oostemberg, P.M. and Senturia, S.D., 'M-Test: a test chip for MEMS material property measurement using electrostatically actuated test structures', J. Microelectromech. Syst. 6 (1997) 107-118.
8. Sharpe, W.N., Jr, Bin Yuan Vaidyanathan and Edwards, R.L., 'Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon', in Proceedings IEEE. The Tenth Annual International Workshop on Micro Electro Mechanical Systems, Nagoya, Japan, 26-30 Jan., 1997, pp. 424-429.
9. Ballarini, R., Mullen, R.L., Yin, Y., Kahn, H., Stemmer, S. and Heuer, A.H., 'The fracture toughness of polycristalline silicon microdevices: a first report', J. Mater. Res. 12(4) (1997) 915-922.
10. Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., 'Specimen size effect on tensile strength of surface micromachined polycristalline silicon films', J. Microelectromech. Syst. 7(1) (1998) 106-113.
11. Chi, S.P. and Wensyang, H., 'A microstructure for in situ determination of residual strain', J. Microelectromech. Syst. 8 (1999) 200-207.
12. Sharpe, W.N., Turner, K.T. and Edwards, R.L., 'Tensile testing of polysilicon', J. Exp. Mech. 39 (1999) 162-170.
13. Chen, G.S., Ju, M.S. and Fang, Y.K., 'Effects of monolithic silicon postulated as an isotropic material on design of microstructures', Sensor Actuat. A 86 (2000) 108-114.
14. Kahn, H., Tayebi, N., Ballarini, R., Mullen, R.L. and Heuer, A.H., 'Fracture toughness of polysilicon MEMS devices', Sensor Actuat. A 82 (2000) 274-280.
15. Kramer, T. and Paul, O., 'Surface Micromachined ring test structures to determine mechanical properties of compressive thin films', Sensor Actuat. A 92 (2000) 292-298.
16. Yi, T., Li, L. and Kim, C.-J., 'Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength', Sensor Actuat. A 83 (2000) 172-178.
17. Ando, T., Shikida, M. and Sato, K., 'Tensile-mode fatigue testing of silicon films as structural material for MEMS', Sensor Actuat. A 93 (2001) 70-75.
18. Muhlstein, C.L., Brown, S.B. and Ritchie, R.O., 'High-cycle fatigue and durability of polycrystalline silicon thin films in ambient air', Sensor Actuat. A 94 (2001) 177-188.
19. Kahn, H., Ballarini, R., Bellante, J.J. and Heuer, A.H., 'Fatigue failure in polysilicon not due to simple stress corrosion cracking', Science 298 (2002) 1215-1218.
20. Chasiotis, I. and Knauss, W.G., A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy', Exp. Mech. 42(1) (2002) 51-57.
21. Bagdahn, J. and Sharpe, W.N. Jr, 'Fracture strength of polysilicon at stress concentrations', J. Microelectromech. Syst. 12 (2003) 302-312.
22. Chasiotis, I. and Knauss, W.G., 'The mechanical strength of polysilicon films: part 1. The influence of fabrication governed surface conditions', J. Mech. Phys. Solids 51 (2003) 1533-1550.
23. Chasiotis, I. and Knauss, W.G., 'The mechanical strength of polysilicon films: part 2. Size effects associated with elliptical and circular perforations', J. Mech. Phys. Solids 51 (2003) 1551-1572.
24. Ballarini, R., Kahn, H., Heuer, A.H., De Boe, M.P. and Dugger, M.T., 'MEMS Structures for on-chip testing of mechanical and surface properties of thin films', in: Milne, I., Ritchie R.O. and Karihaloo B. (eds), Comprehensive Structural Integrity, vol. 8, Chapter 9, 2003, pp. 325-360.
25. Villa, A., De Masi, B., Corigliano, A., Frangi, A. and Comi, C., 'Mechanical characterization of epitaxial polysilicon in MEMS', in: Bathe, K.J. (ed.), Proceedings Second MIT Conference on Computational Fluid and Solid Mechanics, Boston, June 2003, Vol. 1, Elsevier, 2003 pp. 722-726.
26. Corigliano, A. Frangi, A., Comi, C. and De Masi, B., 'Mechanical properties of epitaxial polysilicon at the microscale', in: Proceedings XVI Congresso Nazionale AIMETA, Ferrara, Italy, September 9-12, 2003.
27. Corigliano, A., De Masi, B., Frangi, A., Comi, A., Villa, A. and Marchi, M., 'Mechanical characterization of polysilicon through on chip tensile tests', J. Microelectromech. Syst. 13(2) (2004) 200-219.
28. De Masi, B., Villa, A., Corigliano, A., Frangi, A., Comi, C. and Marchi, M., 'On chip tensile test for epitaxial polysilicon', in: Proceedings: MEMS04, Maastricht, January 25-29, 2004.
29. Cacchione, F., De Masi, B., Corigliano, A. and Ferrera, M., 'Rupture tests on polysilicon films through on-chip electrostatic actuation', in: Proceedings Eurosime 04, Brussels, May 9-12, 2004.
30. Cacchione, F., De Masi, B., Corigliano, A. and Ferrera, M., 'Material characterization at the micro scale through on-chip tests', Proceedings ICFII, Torino, March 20-25, 2005.
31. Cacchione, F., Corigliano, A., De Masi, B., Ferrera, M., 'Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach', in: Proceedings Eurosime 05, Berlin, April 18-20, 2005.
32. Cacchione, F., De Masi, B., Corigliano, A., Ferrera, M. and Vinay, A., 'In-plane and out-of-plane mechanical characterization of thin polysilicon'. Proceedings NSTI Nanotech, Anaheim, CA, U.S.A., May 8-12, 2005.
33. Cacchione, F., Corigliano, A., De Masi, B. and Riva, C., 'Mechanical characterization of thin polysilicon films: on-chip tests and application of the Weibull approach', in preparation (2005).
34. Weibull, W., 'A statistical distribution of wide applicability', J. Appl. Mech. 18 (1951) 293-297.
35. Stanley, P. and Inane, E.Y., 'Assessment of surface strength and bulk strength of a typical brittle material', in: Probabilistic Methods in the Mechanics of Solids and Structures, Proc. Symposium to the memory of W. Weibull, Stockholm, June 19-21, Springer-Verlag, Berlin, 1984.
36. Bažant, Z., Xi, Y. and Reid, S., 'statistical size effect in quasi brittle structures: I. Is Weibull theory applicable?', J. Eng. Mech. ASCE 117 (1991) 2609-2622.