Mechanical characterization of epitaxial polysilicon in MEMS

Computational Fluid and Solid Mechanics 2003

Volumn , Issue , 2003, Pages 722-726

  Villa, Alberto ^a   Masi, Biagio De ^b   Corigliano, Alberto ^a   Frangi, Attilio ^a   Comi, Claudia ^a  

^a POLITECNICO DI MILANO   (Italy)

^b STMICROELECTRONICS   (Italy)

Author keywords

Elastic modulus; Electrostatic actuators; Epitaxial polysilicon; Fracture strength; MEMS

Indexed keywords

ELASTIC MODULI; ELECTROSTATIC ACTUATORS; FRACTURE TOUGHNESS; MEMS; POLYCRYSTALLINE MATERIALS; POLYSILICON; TENSILE TESTING;

FINITE ELEMENT SIMULATIONS; LOW DISPERSIONS; MECHANICAL CHARACTERIZATIONS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); NOTCHED SPECIMENS; ON-CHIP TESTS; TENSION TESTS; YOUNG MODULUS;

FRACTURE;

EID: 84864177235     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B978-008044046-0.50178-0     Document Type: Chapter

References (9)

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3. Kahn H, et al. Fracture toughness of polysilicon MEMS devices. Sensor and Actuators A 2000, 82:274-280.
4. Kramer T, Paul O Surface Micromachined ring test structures to determine mechanical properties of compressive thin films. Sensor and Actuators A 2000, 92:292-298.
5. Oostemberg PM, Senturia SD M-Test: a test chip for MEMS material property measurement using electrostatically acuated test structures. J Microelectromechanical Systems 1997, 6:107-118.
6. Sharpe WN, et al. Tensile testing of polysilicon. J Experimental Mechanics 1999, 39:162-170.
7. Yi T., et al. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength. Sensor and Actuators 2000, 83:172-178.
8. Corigliano A, De Masi B, Frangi A, Comi C, Villa A, Marchi M. Mechanical characterisation of epitaxial silicon through on chip tensile tests (submitted).
9. Thelma Process. Internal technical report, STMicroelectronics, Milano, Italy.