Surface micromachined ring test structures to determine mechanical properties of compressive thin films

Sensors and Actuators, A: Physical

Volumn 92, Issue 1-3, 2001, Pages 292-298

  Kramer, T ^a   Paul, O ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Coefficient of thermal expansion; Mechanical properties; PECVD silicon nitride; Residual strain; Thin films; Young's modulus

Indexed keywords

BUCKLING; ELASTIC MODULI; FINITE ELEMENT METHOD; METALLOGRAPHIC MICROSTRUCTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POISSON RATIO; SILICON NITRIDE; SILICON WAFERS; STRAIN; THERMAL EXPANSION; THIN FILMS;

COEFFICIENT OF THERMAL EXPANSION; COMPRESSIVE THIN FILMS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION SILICON NITRIDE; RESIDUAL STRAIN;

MICROMACHINING;

EID: 0035425941     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00586-6     Document Type: Article

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