On-chip tensile test for epitaxial polysilicon

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 129-132

  De Masi, B ^a   Villa, A ^b   Corigliano, A ^b   Frangi, A ^b   Comi, C ^b   Marchi, M ^a  

^a STMICROELECTRONICS   (Italy)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; EPITAXIAL GROWTH; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; MICROPROCESSOR CHIPS; POLYSILICON; TENSILE TESTING;

ELECTROSTATICALLY ACTUATED DEVICES; ON CHIP TESTING DEVICES; SINGLE EDGE NOTCHED TENSION TESTS;

INTEGRATED CIRCUIT TESTING;

EID: 3042702985     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. I. Chasiotis, W.G. Knauss, "A New Microtensile Tester for the Study of MEMS Materials with the aid of Atomic Force Microscopy", Experimental Mechanics, vol. 42(1), pp. 51-57,2002.
2. H. Kahn, et al. "Fracture toughness of polysilicon MEMS devices", Sensor and Actuators A 82, 2000, 274-280.
3. T. Kramer, O. Paul "Surface Micromachined ring test structures to determine mechanical properties of compressive thin films", Sensor and Actuators A, 2000; 92, 292-298.
4. P.M. Oostemberg, S.D. Senturia "M-Test: a test chip for MEMS material property measurement using electrostatically actuated test structures", J. Microelectromech. Syst, 1997; 6, 107-118.
5. W.N. Sharpe, K.T. Turner, R.L. Edwards, "Tensile testing of polysilicon", J. of Experimental Mechanics, 39,162-170, 1999.
6. A. Corigliano, B. De Masi, A. Frangi, C. Comi, A. Villa, M. Marchi, "Mechanical characterization of polysilicon through on chip tensile tests", J. Microelectromech. Syst., to appear.
7. Thelma Process. Internal thecnical report, STMicroelectronics, Milano, Italy.
8. J. Bagdahn, W.N. Sharpe Jr, "Fracture strength of polysilicon at stress concentrations", J. Microelectromech. Syst, vol. 12, pp. 302-312, 2003.