Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 403-410

  Lau, J ^a   Mei, Z ^a   Pang, S ^a   Amsden, C ^a   Rayner, J ^a   Pan, S ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037480865     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1512294     Document Type: Article

References (13)

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2. Fouquet, J. E., 2000, "Compact Optical Cross-Connect Switch Based on Total Internal Reflection in a Fluid-Containing Planar Lightwave Circuit," Proc., Optical Fiber Communication Conference, Technical Digest, Vol. 1, pp. 204-206.
3. Venkatesh, S., Son, J., Fouquet, J., Haven, R., Schroeder, D., Guo, H., Wang, W., Russell, P., Chow, A., and Hoffmann, P., 2002, "Recent Advances in Bubble-Actuated Photonic Cross-Connect Switches," Proc., SPIE Photonics West, pp. 27-35.
4. Venkatesh, S., DePue, M., Okano, H., and Uetsuka, H., 2002, "Insertion Loss Reduction by Optimization of Waveguide Perturbations," Proc., Optical Fiber Communication Conference, Postdeadline Papers, pp. FA4-1-FA4-3.
5. Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
6. Lau, J. H., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBCA Assemblies, McGraw-Hill, New York, NY.
7. Lau, J. H., and Lee, R., 2001, Microvias for Low Cost High Density Interconnects, McGraw-Hill, New York, NY, pp. 456-457.
8. Lau, J. H., Wong, C. P., Prince, J. L., and Nakayama, W., 1998, Electronic Packaging: Design, Materials, Process, and Reliability, McGraw-Hill, New York, NY.
9. ANSYS Users' Manual, 2002.
10. Mei, Z. and Morris, J., 1992, "Superplastic Creep of Low Melting Point Solder Joints," J. Electron. Mater., 21(4), pp. 401-407.
11. Lau, J. H., 1991, Solder Joint Reliability: Theory and Applications, Van Notrand Reinhold, New York, NY, pp. 225-265.
12. Lau, J., Mei, Z., Pang, S., Amsden, C., Rayner, J., and Pan, S., 2002, "Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch," Proc. Photonic Devices and Systems Packaging Symposium, July, pp. 95-106.
13. Baumeister, T., Avallone, E., and Baumeister III, T., Marks' Handbook for Mechanical Engineers, McGraw-Hill, New York, NY, pp. 3-30.