Open defects in PBGA assembly solder joints

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 157-161

  Fan, S H ^a   Chan, Y C ^a   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Defect; PBGA assembly; Profile; Soldering; Surface mount technology

Indexed keywords

DEFECTS; EUTECTICS; FAILURE (MECHANICAL); HEATING; MATERIALS TESTING; SURFACE MOUNT TECHNOLOGY; THERMODYNAMIC STABILITY;

DEFECTIVE MODES; OPEN DEFECTS; SOLDER MELTING PHASE;

SOLDERED JOINTS;

EID: 0344982091     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1536951     Document Type: Article

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