Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1384-1391

  Cook, B A ^a   Anderson, I E ^a   Harringa, J L ^a   Kang, S K ^b  

^a IOWA STATE UNIVERSITY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Electrical resistivity; Heat treatment; Microstructure; Pb free solder

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; EUTECTICS; HEAT TREATMENT; ISOTHERMS; MICROSTRUCTURE; NUCLEATION; PRECIPITATION (CHEMICAL); SHEAR STRENGTH; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; THERMAL EFFECTS;

HEAT TREATMENT RESISTIVITY; PB-FREE SOLDER;

TIN ALLOYS;

EID: 0942299501     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0105-3     Document Type: Conference Paper

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