Tin pest in lead-free solders

Soldering and Surface Mount Technology

Volumn 13, Issue 1, 2001, Pages 39-40

  Kariya, Yoshiharu ^a   Gagg, Colin ^a   Plumbridge, William J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; LEAD ALLOYS; PHASE TRANSITIONS; QUENCHING; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL EFFECTS; TIN;

ALLOTROPIC TRANSFORMATIONS;

SOLDERING;

EID: 0035112052     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910110361730     Document Type: Article

References (2)

1. Hedges, H.E. (1960), Tin and its Alloys, Edward Arnold, London, pp. 51-3.
2. Napp, D. (1996), "Lead free interconnect materials for the electronics industry", SAMPE Journal, Vol. 32 No. 59, pp. 59-65.