Mechanical properties and shear strength of Sn-3.5Ag-Bi solder alloys

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1864-1867

  Choi, Jin Won ^a   Cha, Ho Seob ^a   Oh, Tae Sung ^a  

^a Hong Ik University   (South Korea)

Author keywords

Lead free solder; Shear strength; Solder bump; Tensile strength; Tin 3.5 silver bismuth

Indexed keywords

COPPER; DISPERSION HARDENING; DUCTILITY; FRACTURE; MELTING; NICKEL; SHEAR STRENGTH; TENSILE STRENGTH; TIN ALLOYS; WETTING;

MELTING POINTS; SOLDER BUMPS;

SOLDERING ALLOYS;

EID: 0036698868     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1864     Document Type: Article

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