Aging treatment characteristics of shear strength in micro solder bump

Materials Transactions

Volumn 43, Issue 12, 2002, Pages 3234-3238

  Yu, Chong Hee ^a   Kim, Kyung Seob ^b   Sun, Yong Bin ^c   Kim, Nam Kyu ^d   Kim, Nam Hoon ^d   Oh, Heang Suk ^a   Chang, Eui Goo ^d  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Yeojoo Institute of Technology   (South Korea)

^c Kyonggi University   (South Korea)

^d Chung Ang University   (South Korea)

Author keywords

Aging; Intermetallic compound; Shear strength; Solder bump; Transmission electron microscopy

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; DIFFUSION IN SOLIDS; FINITE ELEMENT METHOD; GROWTH (MATERIALS); INTERMETALLICS; MELTING; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY;

MICRO SOLDER BUMP; SOLDER TO THE INTERMETALLIC COMPOUND INTERFACE; UNDER BUMP METALLURGY;

CHROMIUM ALLOYS;

EID: 0036998682     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.3234     Document Type: Article

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