Joint shape, microstructure, and shear strength of lead-free solder joints with different component terminations

Journal of Electronic Materials

Volumn 31, Issue 2, 2002, Pages 136-141

  Ahat, Shawkret ^a   Weidong, Huang ^a   Mei, Sheng ^a   Le, Luo ^a  

^a DaimlerChrysler SIM Technology Co Ltd   (China)

Author keywords

SnSb solder; Surface mount technology (SMT); Termination

Indexed keywords

EUTECTICS; FRACTURE; GOLD COMPOUNDS; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); LEAD ALLOYS; METALLIZING; MICROSTRUCTURE; NICKEL; SHEAR STRENGTH; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

JOINT SHAPE; TERMINATION; THICK FILM CIRCUIT TECHNOLOGY;

SEMICONDUCTING TIN COMPOUNDS;

EID: 0036475937     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0160-1     Document Type: Article

References (9)