Issues regarding microstructural coarsening due to aging of eutectic tin-silver solder

TMS Annual Meeting

Volumn , Issue , 1997, Pages 97-103

  Gibson, A W ^a   Choi, S L ^a   Subramanian, K N ^a   Bieler, T R ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; EUTECTICS; FATIGUE OF MATERIALS; INTERMETALLICS; LATTICE VIBRATIONS; MELTING; MICROSTRUCTURE; THERMAL CYCLING; TIN ALLOYS;

TIN SILVER SOLDERS;

SOLDERING ALLOYS;

EID: 0031375944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)