-
1
-
-
36449001091
-
Numerical simulation of electromigration-induced shape changes of voids in bamboo lines
-
O. Kraft, E. Arzt, Numerical simulation of electromigration-induced shape changes of voids in bamboo lines, Applied Physics Letters 66 (16) (1995) 2063-2065.
-
(1995)
Applied Physics Letters
, vol.66
, Issue.16
, pp. 2063-2065
-
-
Kraft, O.1
Arzt, E.2
-
2
-
-
0003181425
-
Morphological stability of a heterophase interface under electromigration conditions
-
L. Klinger, L. Levin, Morphological stability of a heterophase interface under electromigration conditions, Journal of Applied Physics 79 (9) (1996) 6834-6839.
-
(1996)
Journal of Applied Physics
, vol.79
, Issue.9
, pp. 6834-6839
-
-
Klinger, L.1
Levin, L.2
-
3
-
-
0000325907
-
Grain-boundary slit propagation in an electric field
-
L.M. Klinger, X. Chu, W.W. Mullins, C.L. Bauer, Grain-boundary slit propagation in an electric field, Journal of Applied Physics 80 (12) (1996) 6670-6676.
-
(1996)
Journal of Applied Physics
, vol.80
, Issue.12
, pp. 6670-6676
-
-
Klinger, L.M.1
Chu, X.2
Mullins, W.W.3
Bauer, C.L.4
-
4
-
-
0030210970
-
A variational level set approach to multiphase motion
-
H.K. Zhao, T.F. Chan, B. Merriman, S. Osher, A variational level set approach to multiphase motion, Journal of Computational Physics 127 (1996) 179-195.
-
(1996)
Journal of Computational Physics
, vol.127
, pp. 179-195
-
-
Zhao, H.K.1
Chan, T.F.2
Merriman, B.3
Osher, S.4
-
5
-
-
0003661003
-
-
Cambridge University Press, Cambridge
-
J.A. Sethian, Level Set Methods. Evolving Interfaces in Geometry, Fluid Mechanics, Computer Vision and Materials Science, Cambridge University Press, Cambridge, 1996.
-
(1996)
Level Set Methods. Evolving Interfaces in Geometry, Fluid Mechanics, Computer Vision and Materials Science
-
-
Sethian, J.A.1
-
7
-
-
0013002858
-
Computation for electromigration in interconnects of microelectronic devices
-
A. Averbuch, M. Israeli, I. Ravve, I. Yavneh, Computation for electromigration in interconnects of microelectronic devices, Journal of Computational Physics 167 (2001) 316-371.
-
(2001)
Journal of Computational Physics
, vol.167
, pp. 316-371
-
-
Averbuch, A.1
Israeli, M.2
Ravve, I.3
Yavneh, I.4
-
8
-
-
0037431198
-
Electromigration of intergranular voids in metal films for microelectronic interconnects
-
A. Averbuch, M. Israeli, I. Ravve, Electromigration of intergranular voids in metal films for microelectronic interconnects, Journal of Computational Physics 186 (2003) 481-502.
-
(2003)
Journal of Computational Physics
, vol.186
, pp. 481-502
-
-
Averbuch, A.1
Israeli, M.2
Ravve, I.3
-
9
-
-
0031235428
-
A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
-
L. Xia, A.F. Bower, Z. Suo, C.F. Shih, A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion, Journal of the Mechanics and Physics of Solids 45 (9) (1997) 1473-1493.
-
(1997)
Journal of the Mechanics and Physics of Solids
, vol.45
, Issue.9
, pp. 1473-1493
-
-
Xia, L.1
Bower, A.F.2
Suo, Z.3
Shih, C.F.4
-
10
-
-
85190157660
-
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
-
Y.W. Zhang, A. F. Bower, L. Xia, C.F. Shih, Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion, Journal of the Mechanics and Physics of Solids 47 (1999) 1473-1493.
-
(1999)
Journal of the Mechanics and Physics of Solids
, vol.47
, pp. 1473-1493
-
-
Zhang, Y.W.1
Bower, A.F.2
Xia, L.3
Shih, C.F.4
-
11
-
-
0033328722
-
Three dimensional simulations of island formation in a coherent strained epitaxial film
-
Y.W. Zhang, A.F. Bower, Three dimensional simulations of island formation in a coherent strained epitaxial film, Thin Solid Films 357 (1999) 8-12.
-
(1999)
Thin Solid Films
, vol.357
, pp. 8-12
-
-
Zhang, Y.W.1
Bower, A.F.2
-
12
-
-
0034285134
-
X-ray diffraction as a tool to study the mechanical behavior of thin films
-
O. Kraft, M. Hommel, E. Arzt, X-ray diffraction as a tool to study the mechanical behavior of thin films, Materials Science and Engineering A 288 (2000) 209-216.
-
(2000)
Materials Science and Engineering A
, vol.288
, pp. 209-216
-
-
Kraft, O.1
Hommel, M.2
Arzt, E.3
-
13
-
-
0000580606
-
Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation
-
M.R. Gungor, D. Maroudas, Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation. Journal of Applied Physics 85 (4) (1999) 2233-2246.
-
(1999)
Journal of Applied Physics
, vol.85
, Issue.4
, pp. 2233-2246
-
-
Gungor, M.R.1
Maroudas, D.2
-
14
-
-
0035333784
-
Modeling of electromechanically induced failure of passivated metallic thin films used in device interconnections
-
M.R. Gungor, D. Maroudas, Modeling of electromechanically induced failure of passivated metallic thin films used in device interconnections, International Journal of Fracture 109 (2001) 47-68.
-
(2001)
International Journal of Fracture
, vol.109
, pp. 47-68
-
-
Gungor, M.R.1
Maroudas, D.2
-
15
-
-
0000293143
-
Electromigration-driven shape evolution of two-dimensional voids
-
M. Schimschak, J. Krug, Electromigration-driven shape evolution of two-dimensional voids, Journal of Applied Physics 87 (2) (2000) 695-703.
-
(2000)
Journal of Applied Physics
, vol.87
, Issue.2
, pp. 695-703
-
-
Schimschak, M.1
Krug, J.2
-
16
-
-
0033558387
-
Simulations of an electromigration-induced edge instability in single-crystal metal lines
-
M. Mahadevan, R.M. Bradley, J.M. Debierre, Simulations of an electromigration-induced edge instability in single-crystal metal lines, Europhysics Letters 45 (1999) 680-685.
-
(1999)
Europhysics Letters
, vol.45
, pp. 680-685
-
-
Mahadevan, M.1
Bradley, R.M.2
Debierre, J.M.3
-
17
-
-
0000405986
-
Diffuse interface model of diffusion-limited crystal growth
-
J.B. Collins, Diffuse interface model of diffusion-limited crystal growth, Physical Review B 31 (1985) 6119-6122.
-
(1985)
Physical Review B
, vol.31
, pp. 6119-6122
-
-
Collins, J.B.1
-
18
-
-
0001336786
-
Diffuse interface model for electromigration and stress voiding
-
D.N. Bhate, A. Kumar, A.F. Bower, Diffuse interface model for electromigration and stress voiding, Journal of Applied Physics 87 (4) (2000) 1712-1721.
-
(2000)
Journal of Applied Physics
, vol.87
, Issue.4
, pp. 1712-1721
-
-
Bhate, D.N.1
Kumar, A.2
Bower, A.F.3
-
19
-
-
33746012315
-
Free energy of a nonuniform system. I. Interfacial free energy
-
J.W. Cahn, J.E. Hilliard, Free energy of a nonuniform system. I. Interfacial free energy, The Journal of Chemical Physics 28-2 (1958) 258-267.
-
(1958)
The Journal of Chemical Physics
, vol.28-32
, pp. 258-267
-
-
Cahn, J.W.1
Hilliard, J.E.2
-
20
-
-
0001497702
-
Influence of anisotropic surface diffusivity on electromigration induced void migration and evolution
-
D.R. Fridline, A.F. Bower, Influence of anisotropic surface diffusivity on electromigration induced void migration and evolution, Journal of Applied Physics 85 (6) (1999) 3168-3174.
-
(1999)
Journal of Applied Physics
, vol.85
, Issue.6
, pp. 3168-3174
-
-
Fridline, D.R.1
Bower, A.F.2
-
21
-
-
0031117638
-
Electromigration mechanisms in conductor lines: Void shape changes and slit-like failure
-
O. Kraft, E. Arzt, Electromigration mechanisms in conductor lines: void shape changes and slit-like failure, Acta Materialia 45 (4) (1997) 1599-1611.
-
(1997)
Acta Materialia
, vol.45
, Issue.4
, pp. 1599-1611
-
-
Kraft, O.1
Arzt, E.2
-
23
-
-
0012941592
-
Current density and line width effects in electromigration: A new damage-based lifetime model
-
O. Kraft, E. Arzt, Current density and line width effects in electromigration: a new damage-based lifetime model, Acta Materialia 46 (11) (1998) 3733-3743.
-
(1998)
Acta Materialia
, vol.46
, Issue.11
, pp. 3733-3743
-
-
Kraft, O.1
Arzt, E.2
-
24
-
-
0036531418
-
Continuum and atomistic modeling of electromechanically-induced failure of ductile metallic thin films
-
D. Maroudas, M.R. Gungor, Continuum and atomistic modeling of electromechanically-induced failure of ductile metallic thin films, Computational Materials Science 23 (2002) 242-249.
-
(2002)
Computational Materials Science
, vol.23
, pp. 242-249
-
-
Maroudas, D.1
Gungor, M.R.2
-
25
-
-
33845400575
-
Numerical simulations on stress induced void evolution and growth in interconnects
-
D. Fridline, A. Bower, Numerical simulations on stress induced void evolution and growth in interconnects, Journal of Applied Physics 91 (4) (2002) 2380-2390.
-
(2002)
Journal of Applied Physics
, vol.91
, Issue.4
, pp. 2380-2390
-
-
Fridline, D.1
Bower, A.2
-
26
-
-
0000647987
-
Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films
-
M.R. Gungor, D. Maroudas, L.J. Gray, Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films, Applied Physics Letters 73 (26) (1998) 3848-3850.
-
(1998)
Applied Physics Letters
, vol.73
, Issue.26
, pp. 3848-3850
-
-
Gungor, M.R.1
Maroudas, D.2
Gray, L.J.3
-
27
-
-
0000191007
-
Electromigration-induced failure of metallic thin films due to transgranular void propagation
-
M.R. Gungor, D. Maroudas, Electromigration-induced failure of metallic thin films due to transgranular void propagation, Applied Physics Letters 72 (26) (1998) 3452-3454.
-
(1998)
Applied Physics Letters
, vol.72
, Issue.26
, pp. 3452-3454
-
-
Gungor, M.R.1
Maroudas, D.2
-
28
-
-
11744357312
-
Electromigration-induced breakup of two-dimensional voids
-
M. Schimschak, J. Krug, Electromigration-induced breakup of two-dimensional voids, Physical Review Letters 80 (8) (1998) 1674-1677.
-
(1998)
Physical Review Letters
, vol.80
, Issue.8
, pp. 1674-1677
-
-
Schimschak, M.1
Krug, J.2
-
29
-
-
0000141460
-
Surface electromigration as a moving boundary value problem
-
M. Schimschak, J. Krug, Surface electromigration as a moving boundary value problem, Physical Review Letters 78 (2) (1997) 278-281.
-
(1997)
Physical Review Letters
, vol.78
, Issue.2
, pp. 278-281
-
-
Schimschak, M.1
Krug, J.2
-
30
-
-
0001761870
-
Simulations and theory of electromigration-induced slit formation in unpassivated single-crystal metal lines
-
M. Mahadevan, R.M. Bradley, Simulations and theory of electromigration-induced slit formation in unpassivated single-crystal metal lines, Physical Review B 59 (16) (1999) 11037-11046.
-
(1999)
Physical Review B
, vol.59
, Issue.16
, pp. 11037-11046
-
-
Mahadevan, M.1
Bradley, R.M.2
-
31
-
-
0036778668
-
A phase field model for failure in interconnect lines due to coupled diffusion mechanisms
-
D.N. Bhate, A.F. Bower, A. Kumar, A phase field model for failure in interconnect lines due to coupled diffusion mechanisms, Journal of the Mechanics and Physics for Solids 50 (2002) 2057-2083.
-
(2002)
Journal of the Mechanics and Physics for Solids
, vol.50
, pp. 2057-2083
-
-
Bhate, D.N.1
Bower, A.F.2
Kumar, A.3
-
32
-
-
0001740171
-
Current-induced non-linear dynamics of voids in metallic thin films: Morphological transition and surface wave propagation
-
M.R. Gungor, D. Maroudas, Current-induced non-linear dynamics of voids in metallic thin films: Morphological transition and surface wave propagation, Surface Science 461 (2000) L550-L556.
-
(2000)
Surface Science
, vol.461
-
-
Gungor, M.R.1
Maroudas, D.2
-
33
-
-
0032659246
-
Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration
-
M.R. Gungor, D. Maroudas, Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration, Surface Science 432 (1999) L604-L610.
-
(1999)
Surface Science
, vol.432
-
-
Gungor, M.R.1
Maroudas, D.2
-
34
-
-
0032500401
-
Non-linear analysis of the morphological evolution of void surfaces in metallic thin films under surface electromigration conditions
-
M.R. Gungor, D. Maroudas, Non-linear analysis of the morphological evolution of void surfaces in metallic thin films under surface electromigration conditions, Surface Science 415 (1998) L1055-L1060.
-
(1998)
Surface Science
, vol.415
-
-
Gungor, M.R.1
Maroudas, D.2
-
35
-
-
0033101970
-
Approximate Green's functions in boundary integral analysis
-
L.J. Gray, D. Maroudas, M.N. Enmark, E.F. Azevedo, Approximate Green's functions in boundary integral analysis, Engineering Analysis with Boundary Elements 23 (1999) 267-274.
-
(1999)
Engineering Analysis With Boundary Elements
, vol.23
, pp. 267-274
-
-
Gray, L.J.1
Maroudas, D.2
Enmark, M.N.3
Azevedo, E.F.4
-
36
-
-
0033881425
-
Evolving material structures of small feature sizes
-
Z. Suo, Evolving material structures of small feature sizes, International Journal of Solids and Structures 37 (2000) 367-378.
-
(2000)
International Journal of Solids and Structures
, vol.37
, pp. 367-378
-
-
Suo, Z.1
-
37
-
-
0000594331
-
Stable state of interconnect under temperature change and electric current
-
Z. Suo, Stable state of interconnect under temperature change and electric current, Acta Materialia 46 (11) (1998) 3725-3732.
-
(1998)
Acta Materialia
, vol.46
, Issue.11
, pp. 3725-3732
-
-
Suo, Z.1
-
39
-
-
0030129975
-
A global analysis of structural evolution in a row of grains
-
B. Sun, Z. Suo, C.F. Cocks, A global analysis of structural evolution in a row of grains, Journal of the Mechanics and Physics of Solids 44 (4) (1996) 559-581.
-
(1996)
Journal of the Mechanics and Physics of Solids
, vol.44
, Issue.4
, pp. 559-581
-
-
Sun, B.1
Suo, Z.2
Cocks, C.F.3
-
40
-
-
0031146427
-
A finite element method for simulating interface motion - I. Migration of phase grain boundaries
-
B. Sun, Z. Suo, W. Yang, A finite element method for simulating interface motion - I. Migration of phase and grain boundaries, Acta Materialia 45 (5) (1997) 1907-1915.
-
(1997)
Acta Materialia
, vol.45
, Issue.5
, pp. 1907-1915
-
-
Sun, B.1
Suo, Z.2
Yang, W.3
-
41
-
-
0031378762
-
A finite element method for simulating interface motion - II. Large shape change due to surface diffusion
-
B. Sun, Z. Suo, A finite element method for simulating interface motion - II. Large shape change due to surface diffusion, Acta Materialia 45 (12) (1997) 4953-4962.
-
(1997)
Acta Materialia
, vol.45
, Issue.12
, pp. 4953-4962
-
-
Sun, B.1
Suo, Z.2
-
42
-
-
0000020691
-
A level set approach to a unified model for etching, deposition and lithography I: Algorithms and two-dimensional simulations
-
D. Adalsteinsson, J.A. Sethian, A level set approach to a unified model for etching, deposition and lithography I: algorithms and two-dimensional simulations, Journal of Computational Physics 120 (1995) 128-144.
-
(1995)
Journal of Computational Physics
, vol.120
, pp. 128-144
-
-
Adalsteinsson, D.1
Sethian, J.A.2
-
43
-
-
0001163571
-
A level set approach to a unified model for etching, deposition and lithography II: Three-dimensional simulations
-
D. Adalsteinsson, J.A. Sethian, A level set approach to a unified model for etching, deposition and lithography II: three-dimensional simulations, Journal of Computational Physics 122 (1995) 348-366.
-
(1995)
Journal of Computational Physics
, vol.122
, pp. 348-366
-
-
Adalsteinsson, D.1
Sethian, J.A.2
-
44
-
-
0031077740
-
An overview of level set methods for etching, deposition, and lithography development
-
J.A. Sethian, D. Adalsteinsson, An overview of level set methods for etching, deposition, and lithography development, IEEE Transactions on Semiconductor Manufacturing 10 (1) (1997) 167-184.
-
(1997)
IEEE Transactions on Semiconductor Manufacturing
, vol.10
, Issue.1
, pp. 167-184
-
-
Sethian, J.A.1
Adalsteinsson, D.2
-
45
-
-
0030210970
-
A variational level set approach to multiphase motion
-
H. Zhao, T. Chan, B. Merriman, S. Osher, A variational level set approach to multiphase motion, Journal of Computational Physics 127 (1996) 179-195.
-
(1996)
Journal of Computational Physics
, vol.127
, pp. 179-195
-
-
Zhao, H.1
Chan, T.2
Merriman, B.3
Osher, S.4
-
46
-
-
21544450961
-
Theory of thermal grooving
-
W.W. Mullins, Theory of thermal grooving, Journal of Applied Physics 28 (3) (1957) 333-339.
-
(1957)
Journal of Applied Physics
, vol.28
, Issue.3
, pp. 333-339
-
-
Mullins, W.W.1
-
47
-
-
49749218340
-
The effect of thermal grooving on grain boundary motion
-
W.W. Mullins, The effect of thermal grooving on grain boundary motion, Acta Metallurgic Materials 6 (6) (1958) 414-427.
-
(1958)
Acta Metallurgic Materials
, vol.6
, Issue.6
, pp. 414-427
-
-
Mullins, W.W.1
-
48
-
-
0027834161
-
The effect of stress on grain boundary grooving
-
F.Y. Genin, W.W. Mullins, P. Wynblatt, The effect of stress on grain boundary grooving, Acta Metallurgic Materials 41 (12) (1993) 3541-3547.
-
(1993)
Acta Metallurgic Materials
, vol.41
, Issue.12
, pp. 3541-3547
-
-
Genin, F.Y.1
Mullins, W.W.2
Wynblatt, P.3
-
49
-
-
0001586026
-
Dynamics of transgranular voids in metallic thin films under electromigration conditions
-
D. Maroudas, Dynamics of transgranular voids in metallic thin films under electromigration conditions, Applied Physics Letters 67 (6) (1995) 798-800.
-
(1995)
Applied Physics Letters
, vol.67
, Issue.6
, pp. 798-800
-
-
Maroudas, D.1
-
50
-
-
0028491015
-
Electromigration failure by shape change of voids in bamboo lines
-
E. Artz, O. Kraft, W.D. Nix, J.E. Sanchez Jr., Electromigration failure by shape change of voids in bamboo lines, Journal of Applied Physics 76 (3) (1994) 1563-1571.
-
(1994)
Journal of Applied Physics
, vol.76
, Issue.3
, pp. 1563-1571
-
-
Artz, E.1
Kraft, O.2
Nix, W.D.3
Sanchez J.E., Jr.4
-
51
-
-
0038074751
-
In-situ SEM observations of electromigration in thin metal films at accelerated stress conditions
-
J. d'Haen, J. Van Olmen, Z. Beelen, J.V. Manca, T. Martens, W. De Ceuninck, M. d'Olieslaeger, L. De Schepper, M. Cannaerts, K. Maex, In-situ SEM observations of electromigration in thin metal films at accelerated stress conditions, Microelectronics Reliability 40 (2000) 1407-1412.
-
(2000)
Microelectronics Reliability
, vol.40
, pp. 1407-1412
-
-
d'Haen, J.1
Van Olmen, J.2
Beelen, Z.3
Manca, J.V.4
Martens, T.5
De Ceuninck, W.6
d'Olieslaeger, M.7
De Schepper, L.8
Cannaerts, M.9
Maex, K.10
-
53
-
-
0033889799
-
A simulation of asymmetrical voids evolution induced by electromigration
-
Y.X. Gao, H. Fan, Z. Xiao, A simulation of asymmetrical voids evolution induced by electromigration, Mechanics of Materials 32 (2000) 315-326.
-
(2000)
Mechanics of Materials
, vol.32
, pp. 315-326
-
-
Gao, Y.X.1
Fan, H.2
Xiao, Z.3
-
55
-
-
0035424075
-
Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects
-
T.O. Ogurtani, E.E. Oren, Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects, Journal of Applied Physics 90 (3) (2001) 1564-1572.
-
(2001)
Journal of Applied Physics
, vol.90
, Issue.3
, pp. 1564-1572
-
-
Ogurtani, T.O.1
Oren, E.E.2
-
56
-
-
0036350043
-
Void intergranual motion under the action of electromigration forces in thin film interconnects with bamboo structure
-
E.E. Oren, T.O. Ogurtani, Void intergranual motion under the action of electromigration forces in thin film interconnects with bamboo structure, Materials Research Society Symposium Proceedings 695 (2002) 209-215.
-
(2002)
Materials Research Society Symposium Proceedings
, vol.695
, pp. 209-215
-
-
Oren, E.E.1
Ogurtani, T.O.2
-
58
-
-
0035949875
-
Grain boundary crack growth in interconnects with an electric current
-
C.Y. Liu, S. Lee, T.J. Chuang, Grain boundary crack growth in interconnects with an electric current, Materials Science and Engineering B 86 (2001) 101-108.
-
(2001)
Materials Science and Engineering B
, vol.86
, pp. 101-108
-
-
Liu, C.Y.1
Lee, S.2
Chuang, T.J.3
-
59
-
-
0037103690
-
In situ study of void growth kinetics in electroplated Cu lines
-
E. Liniger, L. Gignac, C.K. Hu, S. Kaldor, In situ study of void growth kinetics in electroplated Cu lines, Journal of Applied Physics 92 (4) (2002) 1803-1810.
-
(2002)
Journal of Applied Physics
, vol.92
, Issue.4
, pp. 1803-1810
-
-
Liniger, E.1
Gignac, L.2
Hu, C.K.3
Kaldor, S.4
-
60
-
-
0011704584
-
Electromigration drift velocity in Cu interconnects modeled with level set method
-
M. Nathan, E. Glickman, M. Khenner, A. Averbuch, M. Israeli, Electromigration drift velocity in Cu interconnects modeled with level set method, Applied Physics Letters 77 (21) (2000) 3355-3357.
-
(2000)
Applied Physics Letters
, vol.77
, Issue.21
, pp. 3355-3357
-
-
Nathan, M.1
Glickman, E.2
Khenner, M.3
Averbuch, A.4
Israeli, M.5
-
61
-
-
0011255953
-
Diffusion at the A1/A1 oxide interface during electromigration in wide lines
-
R.A. Augur, R.A. Wolters, W. Schmidt, A.G. Dirks, S. Kordic, Diffusion at the A1/A1 oxide interface during electromigration in wide lines, Journal of Applied Physics 79 (6) (1996) 3003-3010.
-
(1996)
Journal of Applied Physics
, vol.79
, Issue.6
, pp. 3003-3010
-
-
Augur, R.A.1
Wolters, R.A.2
Schmidt, W.3
Dirks, A.G.4
Kordic, S.5
|