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Surface Science

Volumn 432, Issue 3, 1999, Pages

Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration

(2) Gungor, M Rauf a Maroudas, Dimitrios a

a University of California (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; DIFFUSION IN SOLIDS; ELECTRON TRANSPORT PROPERTIES; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; PASSIVATION; PHASE EQUILIBRIA; RESIDUAL STRESSES; SURFACE PHENOMENA; SURFACE ROUGHNESS; SURFACE STRUCTURE;

ELECTROMIGRATION INDUCED SLIT PROPAGATION; NONHYDROSTATIC STRESS EFFECTS; SURFACE ELECTRICAL TRANSPORT; VOID SURFACE ELECTROMIGRATION;

METALLIC FILMS;

EID: 0032659246 PISSN: 00396028 EISSN: None Source Type: Journal
DOI: 10.1016/S0039-6028(99)00655-X Document Type: Article

Times cited : (17)

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