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Volumn 23, Issue 1-4, 2002, Pages 242-249
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Continuum and atomistic modeling of electromechanically-induced failure of ductile metallic thin films
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Author keywords
Boundary element method; Dislocation emission; Electromigration; Models of non equilibrium and non linear phenomena; Molecular dynamics simulations; Surface diffusion; Thin film failure; Void growth
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Indexed keywords
COMPUTER SIMULATION;
DUCTILITY;
ELECTROMIGRATION;
FAILURE ANALYSIS;
METALLIC FILMS;
MOLECULAR DYNAMICS;
MORPHOLOGY;
PLASTIC DEFORMATION;
STRAIN;
SURFACE PROPERTIES;
DUCTILE METALLIC THIN FILMS;
THIN FILMS;
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EID: 0036531418
PISSN: 09270256
EISSN: None
Source Type: Journal
DOI: 10.1016/S0927-0256(01)00229-4 Document Type: Article |
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Times cited : (20)
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References (30)
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