Electromigration-induced failure of metallic thin films due to transgranular void propagation

Applied Physics Letters

Volumn 72, Issue 26, 1998, Pages 3452-3454

  Gungor, M Rauf ^a   Maroudas, Dimitrios ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000191007     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.121663     Document Type: Article

References (18)

1. P. S. Ho and T. Kwok, Rep. Prog. Phys. 52, 301 (1989);
2. C. V. Thompson and J. R. Lloyd, Mater. Res. Bull. 18, No. 12, 19 (1993), and references therein.
3. J. E. Sanchez, Jr., L. T. McKnelly, and J. W. Morris, Jr., J. Electron. Mater. 19, 1213 (1990);
4. J. Appl. Phys. 72, 3201 (1992);
5. J. H. Rose, Appl. Phys. Lett. 61, 2170 (1992);
6. E. Arzt, O. Kraft, W. D. Nix, and J. E. Sanchez, Jr., J. Appl. Phys. 76, 1563 (1994);
7. Y.-C. Joo and C. V. Thompson, 81, 6062 (1997).
8. O. Kraft, S. Bader, J. E. Sanchez, Jr., and E. Arzt, Mater. Res. Soc. Symp. Proc. 309, 199 (1993).
9. O. Kraft and E. Arzt, Acta Mater. 45, 1599 (1997).
10. Z. Suo, W. Wang, and M. Yang, Appl. Phys. Lett. 64, 1944 (1994);
11. W. Q. Wang, Z. Suo, and T.-H. Hao, J. Appl. Phys. 79, 2394 (1996).
12. O. Kraft and E. Arzt, Appl. Phys. Lett. 66, 2063 (1995).
13. D. Maroudas, Appl. Phys. Lett. 67, 798 (1995);
14. D. Maroudas et al., J. Comp.-Aided Mater. Des. 2, 231 (1995).
15. L. Xia, A. F. Bower, Z. Suo, and C. F. Shih, J. Mech. Phys. Solids 45, 1473 (1997).
16. C.-L. Liu, J. M. Cohen, J. B. Adams, and A. F. Voter, Surf. Sci. 253, 334 (1991).
17. D. Maroudas et al., Mater. Res. Soc. Symp. Proc. (to be published).
18. P. S. Ho, J. Appl. Phys. 41, 64 (1970).