Numerical simulations of stress induced void evolution and growth in interconnects

Journal of Applied Physics

Volumn 91, Issue 3, 2002, Pages 2380-2390

  Fridline, Daniel ^a   Bower, Allan ^a  

^a Brown University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN-BOUNDARY DIFFUSION; INTERCONNECT FAILURE; INTERCONNECT RELIABILITY; KINETIC PROCESS; LONG INTERCONNECT; MATERIAL PROPERTY; NARROW SLITS; RELATIVE RATES; STRESS INDUCED VOID; VOID GROWTH;

PHYSICAL PROPERTIES; PHYSICS;

GRAIN BOUNDARIES;

EID: 33845400575     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1428097     Document Type: Article

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