A phase field model for failure in interconnect lines due to coupled diffusion mechanisms

Journal of the Mechanics and Physics of Solids

Volumn 50, Issue 10, 2002, Pages 2057-2083

  Bhate, Deepali N ^a   Bower, Allan F ^a   Kumar, Ashish ^a  

^a Brown University   (United States)

Author keywords

A. Diffusion; A. Electromigration; B. Voids; C. Finite elements

Indexed keywords

ASYMPTOTIC STABILITY; COMPUTER SIMULATION; CONVERGENCE OF NUMERICAL METHODS; DIFFUSION; ELECTROMIGRATION; FINITE ELEMENT METHOD; GEOMETRY; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MICROSTRUCTURE; STRESS ANALYSIS;

DIFFUSE INTERFACES;

MICROELECTRONIC PROCESSING;

EID: 0036778668     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(02)00019-4     Document Type: Article

References (28)

1. Electromigration failure by shape change of voids in bamboo lines
2. Diffuse interface model for electromigration and stress-voiding
3. The Cahn-Hilliard gradient theory for phase separation with non-smooth free energy. Part I: Mathematical analysis
4. The Cahn-Hilliard gradient theory for phase separation with non-smooth free energy. Part II: Numerical analysis
5. Curvature dependent phase boundary motion and parabolic double obstacle problems
6. Analysis of failure mechanisms in the interconnect lines of microelectronic circuits
7. Phase separation by spinodal decomposition in isotropic systems
8. Kinetics of phase decomposition processes: Numerical solutions to Cahn-Hilliard equation
9. Double obstacle phase field computations of dendritic growth
10. Generalised double obstacle phase field approximation of the anisotropic mean curvature flow
11. Dynamic solid-solid transitions with phase characterized by an order parameter
12. A phase field theory for solidification based on general anisotropic sharp interface theory with interfacial energy and entropy
13. Motion of inclusion induced by a direct current and a temperature gradient
14. A numerical approach to three dimensional dendritic solidification
15. The interactions of composition and stress in crystalline solids
16. Phase field models of surface electromigration in thin metal films
17. Simulations and theory of electromigration induced slit formation in unpassivated single crystal metal lines
18. Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields
19. A dynamic mesh algorithm for curvature dependent evolving interfaces
20. Electromigration mass transport phenomena in Al thin-film conductors with bamboo structure
21. Study of phase separation dynamics by use of cell dynamical systems. I. Modeling
22. Real-time TEM studies of electromigration in submicron aluminum runners
23. Electromigration-induced breakup of two-dimensional voids
24. The multiphase-field model with an integrated concept for modeling solute diffusion
25. Shape instability during precipitate growth in coherent solids
26. Phase field model for isothermal phase transitions in binary alloys