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Materials Science and Engineering: B

Volumn 86, Issue 2, 2001, Pages 101-108

Grain boundary crack growth in interconnects with an electric current

(3) Liu, Chao Yuan a Lee, Sanboh a Chuang, Tze jer b

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

Crack growth; Electromigration; Grain boundary; Interconnect

Indexed keywords

CRACK PROPAGATION; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROMIGRATION; GRAIN BOUNDARIES; MASS TRANSFER; POLYCRYSTALLINE MATERIALS; THIN FILM DEVICES; TRANSMISSION ELECTRON MICROSCOPY;

THIN FILM INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0035949875 PISSN: 09215107 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-5107(00)00804-7 Document Type: Article

Times cited : (10)

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