Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films

Applied Physics Letters

Volumn 73, Issue 26, 1998, Pages 3848-3850

  Gungor, M Rauf ^a   Maroudas, Dimitrios ^a   Gray, Leonard J ^b  

^a University of California   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000647987     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.122913     Document Type: Article

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