Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

International Journal of Fracture

Volumn 109, Issue 1, 2001, Pages 47-68

  Gungor, M Rauf ^a   Maroudas, Dimitrios ^a  

^a University of California   (United States)

Author keywords

Anisotropy; Diffusion; Electromigration; Mechanical failure; Metallic thin films; Plasticity; Voids

Indexed keywords

ANISOTROPY; DEFORMATION; FAILURE (MECHANICAL); INTEGRATED CIRCUITS; STABILITY; THERMAL STRESS;

SURFACE DIFFUSIVITY;

THIN FILMS;

FILM;

EID: 0035333784     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011054731371     Document Type: Article

References (58)

1. Electromigration failure by shape change of voids in bamboo lines
2. Mechanical strains and stresses in aluminum and copper interconnect lines for 0.18 μm logic technologies
3. Mean-field theory of electromigration induced void drift and coalescence in metal thin films
4. Analysis of stress-induced void growth mechanisms in passivated interconnect lines
5. Finite element analysis of electromigration and stress induced diffusion in deformable solids
6. Void nucleation on a contaminated patch
7. Electromigration-induced void drift and coalescence: Simulations and a dynamic scaling theory
8. Electromigration in thin films
9. Embedded-atom-method functions for the fee metals Cu, Ag, Au, Ni, Pd, Pt, and their alloys
10. Mass conserved morphological evolution of hypocycloid cavities: A model of diffusive crack initiation with no associated energy harrier
11. Void nucleation in passivated interconnect lines: Effects of site geometries, interfaces, and interface flaws
12. Galerkin boundary-integral method for evaluating surface derivatives
13. Approximate Green's functions in boundary integral analysis
14. Electromigration-induced failure of metallic thin films due to transgranular void propagation
15. Nonlinear analysis of the morphological evolution of void surfaces in metallic thin films under surface electromigration conditions
16. Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation
17. Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration
18. Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films
19. Modeling of failure in metallic thin films induced by stress and electromigration: A multiscale computational analysis
20. Linear analysis of electromigration-induced void instability in Al-based interconnects
21. Theoretical analysis of faceted void dynamics in metallic thin films under electromigration conditions
22. Motion of inclusion induced by a direct current and a temperature gradient
23. Electromigration in metals
24. Copper interconnections and reliability
25. Evolution of electromigration-induced voids in single crystalline aluminum lines with different crystallographic orientations
26. Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects
27. Interface stability in an electric field
28. Morphological stability of a heterophase interface under electromigration conditions
29. Grain-boundary slit propagation in an electric field
30. Observation and modelling of electromigration-induced void growth in Al-based interconnects
31. Numerical simulation of electromigration-induced shape changes of voids in bamboo lines
32. Electromigration mechanisms in conductor lines: Void shape changes and slit-like failure
33. Quantitative analysis of electromigration damage in Al-based conductor lines
34. Current-induced faceting of crystal surfaces
35. EAM study of surface self-diffusion of single adatoms of fee metals Ni, Cu, Al, Ag, Au, Pd, and Pt
36. Diffusion mechanisms at fee metal surfaces - Embedded atom method calculations
37. Stability of a circular void in a passivated, current-carrying metal film
38. Simulations and theory of electromigration-induced slit formation in unpassivated single-crystal metal lines
39. Dynamics of transgranular voids in metallic thin films under electromigration conditions
40. Theory and computer simulation of grain-boundary and void dynamics in polycrystalline conductors
41. Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields
42. Fatal electromigration voids in narrow aluminum-copper interconnect
43. Morphology of electromigration-induced damage and failure in Al alloy thin film conductors
44. Microstructural analysis of electromigration-induced voids and hillocks
45. Slit morphology of eletromigration-induced open circuit failures in fine line conductors
46. Electromigration-induced transgranular slit failures in near bamboo Al and Al-2%Cu thin-film interconnects
47. Surface electromigration as a moving boundary value problem
48. Electromigration-induced breakup of two-dimensional voids
49. Basic concepts in electromigration
50. Electromigration instability: Transgranular slits in interconnects
51. Electromigration and IC interconnects
52. A simulation of electromigration induced transgranular slits
53. A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
54. Cavity and dislocation instability due to electric current
55. Surface morphology evolution in stressed solids - Surface diffusion controlled crack initiation
56. Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion