A vapor-phase deposited polymer film to improve the adhesion of electroless-deposited copper layer onto various kinds of substrates

Langmuir

Volumn 30, Issue 3, 2014, Pages 916-921

  You, Jae Bem ^a   Kim, Shin Young ^a   Park, Yong Jin ^b   Ko, Young Gwan ^b   Im, Sung Gap ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONFORMAL COVERAGE; DEPOSITION PROCESS; ELECTRODEPOSITED METALS; INDUSTRIAL-SCALE PRODUCTION; INITIATED CHEMICAL VAPOR DEPOSITIONS; INORGANIC SUBSTRATES; MINIMUM FEATURE SIZES; POLY(4-VINYLPYRIDINE) (P4VP);

ADHESION; CHEMICAL VAPOR DEPOSITION; COPPER; METALLIC FILMS; POLYMER FILMS; POLYMERS; VAPORS;

SUBSTRATES;

EID: 84893497073     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la404251h     Document Type: Article

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