Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications

Applied Surface Science

Volumn 185, Issue 3-4, 2002, Pages 289-297

  Rohan, James F ^a   O′Riordan, Gerald ^a   Boardman, Jane ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Barrier layer; Copper bond pads; Electroless deposition; Flip chip

Indexed keywords

COPPER; FLIP CHIP DEVICES; GOLD; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; MICROELECTRONICS; NICKEL; SPUTTER DEPOSITION;

BONDING LAYERS;

ELECTROLESS PLATING;

EID: 0037080074     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(01)00982-5     Document Type: Article

References (8)

1. Fundamentals of electrochemical deposition