Patterned electroless deposition of copper by microcontact printing palladium(II) complexes on titanium-covered surfaces

Langmuir

Volumn 16, Issue 16, 2000, Pages 6367-6373

  Kind, Hannes ^a,b   Geissler, Matthias ^c   Schmid, Heinz ^a   Michel, Bruno ^a   Kern, Klaus ^b   Delamarche, Emmanuel ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b EPFL   (Switzerland)

^c FRIEDRICH SCHILLER UNIVERSITY JENA   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYST ACTIVITY; COPPER PLATING; ELASTOMERS; INK; PALLADIUM COMPOUNDS; PRINTING; SUBSTRATES; TITANIUM;

CATALYTIC PRECURSORS; HYDROPHILIZATION; MICROCONTACT PRINTING;

ELECTROLESS PLATING;

EID: 0034248008     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la991584p     Document Type: Article

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