Surface modification of polyimide film by coupling reaction for copper metallization

Journal of Industrial and Engineering Chemistry

Volumn 15, Issue 1, 2009, Pages 23-30

  Kim, Hwa Jin ^a,b   Park, Yun Jun ^a   Choi, Jong Ho ^a   Han, Hak Soo ^b   Hong, Young Taik ^a  

^a Korea Research Institute of Chemical Technology   (South Korea)

^b Yonsei University   (South Korea)

Author keywords

Adhesion; Copper; Coupling reaction; Flexible copper clad laminate; Polyimide; Surface modification

Indexed keywords

EID: 63349103210     PISSN: 1226086X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jiec.2008.08.016     Document Type: Article

References (22)

1. Lee K.W., and Viehbeck A. In: Ghosh M.K., and Mittal K.L. (Eds). Polyimides: Fundamentals and Applications (1996), Marcel Dekker, New York 505
2. Kim M.W., Hyun S.H., Kong J.Y., Park L.S., and Kim W.S. J. Ind. Eng. Chem. 12 (2006) 261
3. Jung B.T., Choi H.W., Park K.S., and Suh D.H. J. Ind. Eng. Chem. 9 (2003) 134
4. Oh S.B., Kim B.S., and Kim J.H. J. Ind. Eng. Chem. 12 (2006) 275
5. Stoog C.E. Prog. Polym. Sci. 16 (1991) 561
6. Kent M., Saunders R., Emerson J., and Hurst M. International SAMPE Technology Conference, vol. 27 (1995) 1019
7. Meng J., Liang G., and Zhao L. Compos. Sci. Technol. 62 (2002) 783
8. LeGoues F.K., Silverman B.D., and Ho P.S. J. Vac. Sci. Technol. A 6 (1988) 2200
9. Hong C.K., Hwang I., Kim N., Park D.H., Hwang B.S., and Nah C. J. Ind. Eng. Chem. 14 (2008) 71
10. Paupel F., Yang C.H., Chen S.T., and Ho P.S. J. Appl. Phys. 65 1989 (1911)
11. Ramos M.M.D. Vacuum 64 (2002) 255
12. Hwang S.N., Jeon B.J., and Jung I.H. J. Korean Ind. Eng. Chem. 9 (1998) 383
13. Chou N.J., Dong D.W., Kim J., and Liu A.C. Electrochem. Soc. 131 (1984) 2335
14. Sanjana Z.N., Valentich J., Marchetti J.R., and Cent R.D. National SAMPE Symposium and Exhibition, vol. 28 (1983) 1240
15. Schmitt-Thomas K.G., and Wege S. Brazing Soldering 11 (1986) 27
16. Inagaki N., Tasaka S., and Hibi K. J. Polym. Sci. A: Polym. Chem. 30 (1992) 1425
17. Ponter A.B., and Boyer A.P. Can. J. Chem. 50 (1972) 1613
18. Huang X.D., Bhangale S.M., Moran P.M., Yakovlev N.L., and Pan J. Polym. Int. 52 (2003) 1064
19. Egitto F.D., and Matienzo L.J. In: Ghosh M.K., and Mittal K.L. (Eds). Poyimides: Fundamentals and Applications (1996), Marcel Dekker, New York 409
20. Chentie A. J. Vac. Sci. Thecnol. A 6 (2003) 815
21. Kim D., and Shen Y.R. Appl. Phys. Lett. 74 (1999) 3314
22. Boese D., Lee H., Yoon D.Y., Swalen J.D., and Rabolt J.F. J. Polym. Sci. B: Polym. Phys. 30 (1992) 1321