Effect of oxygen plasma etching on adhesion between polyimide films and metal

Thin Solid Films

Volumn 290-291, Issue , 1996, Pages 367-369

  Nakamura, Y ^a   Suzuki, Y ^a   Watanabe, Y ^a  

^a NATIONAL DEFENSE ACADEMY   (Japan)

Author keywords

Adhesion; Chemical state; Oxygen plasma etching; Polyimide

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; FILM PREPARATION; MORPHOLOGY; PLASMA ETCHING; POLYIMIDES; SUBSTRATES; SURFACE ROUGHNESS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

OXYGEN PLASMA ETCHING;

PLASTIC FILMS;

EID: 0030382632     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)09017-7     Document Type: Article

References (7)

1. Y.K. Lee and J.D. Craig, in E.D. Feit and C.W. Wilkins, Jr. (eds.), Polymer materials for Electronic Applications, ACS Symposium Series, American Chemical Society, Washington, DC, 1982, Vol. 184, p. 107.
2. G.D. Davis, B.J. Ress and P.L. Whisnant, J. Vac. Sci. Technol., A12 (4) (1994) 2379.
3. Da-Yuan Shih, Nancy Klymko, Richard Flitsh, Jurij Paraszczak and Sharan Nunes, J. Vac. Sci. Technol., A9 (6) (1991) 2963.
4. P.O. Hahn, G.W. Rubloff, J.W. Bartha, F.K. LeGoues, R. Tromp and P.S. Ho, in E. Geiss, K. Tu and D.R. Uhlmann (eds.), Proc. on Electronics Packaging and Material Science, Materials Research Society, Pittsburgh, PA, 1985, p. 251.
5. J. Leu and K.F. Jensen, J. Vac. Sci. Technol., A9 (6) (1991) 2948.
6. F. Shimura, Semiconductor Silicon Crystal Technology, Academic Press, San Diego, CA, 1989, p. 191.
7. Hyo-Soo Jeong, Y.Z. Chu, C.J. Durning and R.C. White, Surface Interface Anal., 18 (1992) 289.