Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

International Journal of Adhesion and Adhesives

Volumn 22, Issue 6, 2002, Pages 471-475

  Chan Park, M B ^a   Tan, S S ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Megachem Pte Ltd   (Singapore)

Author keywords

Adhesion; B. Plasma; Graft; Polyimide

Indexed keywords

ADHESION; COPOLYMERIZATION; COPPER; HIGH TEMPERATURE OPERATIONS; PRESSURE EFFECTS; SHEAR STRENGTH;

PHOTOINITIATORS;

POLYAMIDES;

EID: 0036448821     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(02)00057-X     Document Type: Article

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