Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process

Applied Surface Science

Volumn 271, Issue , 2013, Pages 303-310

  Wang, Yong ^a   Bian, Cheng ^a   Jing, Xinli ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Adhesion; Electroless copper plating; Phenolic resin matrix composite; Sensitization

Indexed keywords

ADHESION; CHEMICAL DETECTION; CHLORINE COMPOUNDS; POTASH; RESINS; SILVER COMPOUNDS; TIN COMPOUNDS;

ADHESION IMPROVEMENT; ELECTROLESS COPPER PLATING; ENVIRONMENT FRIENDLY; POTASSIUM PERMANGANATE; RESIN MATRIX COMPOSITES; SENSITIZATION; SENSITIZATION PROCESS; SILVER NITRATE SOLUTIONS;

COPPER PLATING;

EID: 84875366299     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2013.01.188     Document Type: Article

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