Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates

Acta Materialia

Volumn 46, Issue 18, 1998, Pages 6623-6630

  Kriese, M D ^a   Moody, N R ^b   Gerberich, W W ^a  

^a University of Minnesota   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; BOND STRENGTH (MATERIALS); DELAMINATION; METALLIC FILMS; SILICA; SILICON; STRAIN; SUBSTRATES; THIN FILMS;

ADHESION ENERGY;

COPPER;

EID: 0032205540     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00277-8     Document Type: Article

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