Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition

Applied Surface Science

Volumn 256, Issue 11, 2010, Pages 3554-3558

  Lu, Yinxiang ^a,b  

^a FUDAN UNIVERSITY   (China)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Adhesion strength; Electroless copper plating; Poly(ethylene terephthalate) film; Ultrasonic assisted

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); COPPER PLATING; ELECTROLESS PLATING; ETHYLENE; POLYETHYLENE TEREPHTHALATES; SCANNING ELECTRON MICROSCOPY; THIN FILMS; TOPOGRAPHY; ULTRASONIC EFFECTS; ULTRASONIC TESTING; X RAY DIFFRACTION;

ASSISTED DEPOSITION; COPPER THIN FILM; ELECTRICAL CONDUCTIVITY; ELECTROLESS COPPER PLATING; PEEL ADHESION STRENGTH; POLY(ETHYLENE TEREPHTHALATE) (PET); ULTRASONIC TECHNIQUES; ULTRASONIC VIBRATION;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 77649187903     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.12.153     Document Type: Article

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