Prediction of losses caused by roughness of metallization in printed-circuit boards

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 2, 2007, Pages 279-287

  Deutsch, Alina ^a   Surovic, Christopher W ^a   Krabbenhoft, Roger S ^b   Kopcsay, Gerard V ^a   Chamberlin, Bruce J ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

Characterization of card wiring permittivity; Metallization roughness; Printed circuit board losses

Indexed keywords

BROADBAND NETWORKS; COMPUTER SIMULATION; METALLIZING; OPTICAL INTERCONNECTS; SURFACE ROUGHNESS;

CARD WIRING PERMITTIVITY; METALLIZATION ROUGHNESS;

PRINTED CIRCUIT BOARDS;

EID: 34249821907     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.896008     Document Type: Conference Paper

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